Assignee
SUBTRON TECHNOLOGY CO LTD
TW·32 granted patents·19 pending applications·90 citations·filing 1999–2023
Top patents by PatentIndex Score
51 records- 0193US7223687B1Printed wiring board and method of fabricating the sameSUBTRON TECHNOLOGY CO LTD·Filed 2006·Granted May 29, 2007·36 cites·15 claims
- 0277US9870931B2Package carrier and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2016·Granted Jan 16, 2018·2 cites·12 claims
- 0373US9591753B2Circuit board and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2015·Granted Mar 7, 2017·3 cites·10 claims
- 0472US9418931B2Package structure and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2015·Granted Aug 16, 2016·2 cites·20 claims
- 0570US10297517B2Manufacturing method of package carrierSUBTRON TECHNOLOGY CO LTD·Filed 2017·Granted May 21, 2019·2 cites·6 claims
- 0669US7838338B2Fabricating process of thermal enhanced substrateSUBTRON TECHNOLOGY CO LTD·Filed 2010·Granted Nov 23, 2010·3 cites·4 claims
- 0768US9041166B2Manufacturing method of circuit structureSUBTRON TECHNOLOGY CO LTD·Filed 2014·Granted May 26, 2015·1 cites·6 claims
- 0866US10798822B2Method of manufacturing a component embedded package carrierSUBTRON TECHNOLOGY CO LTD·Filed 2018·Granted Oct 6, 2020·1 cites·5 claims
- 0966US9578750B2Package carrier and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2013·Granted Feb 21, 2017·2 cites·12 claims
- 1066US7786501B2Fabricating process and structure of thermal enhanced substrateSUBTRON TECHNOLOGY CO LTD·Filed 2008·Granted Aug 31, 2010·4 cites·6 claims
- 1163US10177067B2Manufacturing method of package carrierSUBTRON TECHNOLOGY CO LTD·Filed 2017·Granted Jan 8, 2019·1 cites·13 claims
- 1263US9668351B2Package carrier and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2015·Granted May 30, 2017·1 cites·16 claims
- 1362US7540969B2High thermal conducting circuit substrate and manufacturing process thereofSUBTRON TECHNOLOGY CO LTD·Filed 2006·Granted Jun 2, 2009·2 cites·17 claims
- 1461US9589942B2Package structure and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2015·Granted Mar 7, 2017·1 cites·13 claims
- 1561US9236364B2Package carrier and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2013·Granted Jan 12, 2016·1 cites·9 claims
- 1660US7441329B2Fabrication process circuit board with embedded passive componentSUBTRON TECHNOLOGY CO LTD·Filed 2005·Granted Oct 28, 2008·2 cites·10 claims
- 1758US9761515B2Substrate structureSUBTRON TECHNOLOGY CO LTD·Filed 2017·Granted Sep 12, 2017·0 cites·7 claims
- 1857US2011253439A1Circuit substrate and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2010·Application pending·0 cites
- 1956US9648760B2Substrate structure and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2016·Granted May 9, 2017·0 cites·7 claims
- 2056US2025089162A1Substrate structureSUBTRON TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 2153US9961784B2Manufacturing method of circuit substrateSUBTRON TECHNOLOGY CO LTD·Filed 2017·Granted May 1, 2018·0 cites·4 claims
- 2253US2023422411A1Substrate structureSUBTRON TECHNOLOGY CO LTD·Filed 2022·Application pending·0 cites
- 2351US10319610B2Package carrierSUBTRON TECHNOLOGY CO LTD·Filed 2017·Granted Jun 11, 2019·0 cites·9 claims
- 2450US2022157674A1Substrate structureSUBTRON TECHNOLOGY CO LTD·Filed 2021·Application pending·0 cites
- 2549US11171072B2Heat dissipation substrate and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2020·Granted Nov 9, 2021·0 cites·6 claims
- 2649US10123413B2Package substrate and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2017·Granted Nov 6, 2018·0 cites·12 claims
- 2749US6353997B1Layer build-up method for manufacturing multi-layer boardSUBTRON TECHNOLOGY CO LTD·Filed 1999·Granted Mar 12, 2002·13 cites·34 claims
- 2849US2009196979A1Inkjet printing process for circuit boardSUBTRON TECHNOLOGY CO LTD·Filed 2008·Application pending·0 cites
- 2949US2023403826A1Heat dissipation substrateSUBTRON TECHNOLOGY CO LTD·Filed 2022·Application pending·0 cites
- 3048US2023068160A1Package carrier and package structureSUBTRON TECHNOLOGY CO LTD·Filed 2022·Application pending·0 cites
- 3148US2009139756A1Fabricating process of circuit board with embedded passive componentSUBTRON TECHNOLOGY CO LTD·Filed 2008·Application pending·0 cites
- 3247US9510453B2Package carrierSUBTRON TECHNOLOGY CO LTD·Filed 2016·Granted Nov 29, 2016·0 cites·4 claims
- 3347US2009288859A1Non-cylinder via structure and thermal enhanced substrate having the sameSUBTRON TECHNOLOGY CO LTD·Filed 2009·Application pending·0 cites
- 3447US2009314650A1Process of package substrateSUBTRON TECHNOLOGY CO LTD·Filed 2009·Application pending·0 cites
- 3546US9883594B2Substrate structure for packaging chipSUBTRON TECHNOLOGY CO LTD·Filed 2017·Granted Jan 30, 2018·0 cites·5 claims
- 3646US2016282055A1Heat dissipation plate and package structureSUBTRON TECHNOLOGY CO LTD·Filed 2016·Application pending·0 cites
- 3745US9693468B2Package substrate and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2015·Granted Jun 27, 2017·0 cites·7 claims
- 3843US6232551B1Substrate board for semiconductor packageSUBTRON TECHNOLOGY CO LTD·Filed 1999·Granted May 15, 2001·13 cites·14 claims
- 3943US2011154658A1Circuit substrate and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2010·Application pending·0 cites
- 4043US2021096298A1Optical waveguide circuit substrate and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2020·Application pending·0 cites
- 4142US10957614B2Heat dissipation substrate and fabricating method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2019·Granted Mar 23, 2021·0 cites·6 claims
- 4242US2013043016A1Structure and process of heat dissipation substrateSUBTRON TECHNOLOGY CO LTD·Filed 2011·Application pending·0 cites
- 4339US11764451B2Waveguide structureSUBTRON TECHNOLOGY CO LTD·Filed 2021·Granted Sep 19, 2023·0 cites·8 claims
- 4439US8384216B2Package structure and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2011·Granted Feb 26, 2013·0 cites·9 claims
- 4539US2017086293A1Package carrier and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
- 4638US9933149B2Illumination apparatusSUBTRON TECHNOLOGY CO LTD·Filed 2015·Granted Apr 3, 2018·0 cites·11 claims
- 4736US2011151273A1Laminate for printed circuit boardSUBTRON TECHNOLOGY CO LTD·Filed 2010·Application pending·0 cites
- 4834US9458540B2Package substrate and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2015·Granted Oct 4, 2016·0 cites·10 claims
- 4934US2011204021A1Method of making fine-pitch circuit linesSUBTRON TECHNOLOGY CO LTD·Filed 2010·Application pending·0 cites
- 5033US2016095256A1Heat dissipation moduleSUBTRON TECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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