Heat dissipation plate and package structure

Abstract

A heat dissipation plate including a heat-conductive material layer, a first metal layer, a metal substrate, a metal ring frame, and a second metal layer is provided. The heat-conductive material layer has an upper surface and a lower surface opposite to each other. The first metal layer is disposed on the lower surface of the heat-conductive material layer and has a first rough surface structure. The metal substrate is disposed below the first metal layer and has a second rough surface structure. The metal ring frame is disposed between the first metal layer and the metal substrate. The second metal layer is disposed on the upper surface of the heat-conductive material layer. The first and second rough surface structures and the metal ring frame define a fluid chamber, and a working fluid flows in the fluid chamber. A package structure including the heat dissipation plate is also provided.

What is claimed is: 
     
         1 . A heat dissipation plate, suitable for carrying a heat generating element, the heat dissipation plate comprising:
 a heat-conductive material layer having an upper surface and a lower surface opposite to each other, wherein a material of the heat-conductive material layer comprises ceramic or silicon germanium, and a thermal expansion coefficient of the heat-conductive material layer is close to a thermal expansion coefficient of the heat generating element;   a first metal layer disposed on the lower surface of the heat-conductive material layer and having a first rough surface structure, wherein the heat-conductive material layer is disposed between the first metal layer and the heat generating element, the first rough surface structure is a concave-convex surface structure, and a maximum value of a maximum height per length of the first rough surface structure ranges from several micrometers to several centimeters;   a metal substrate disposed below the first metal layer and having a second rough surface structure, wherein the second rough surface structure is a concave-convex surface structure, and a maximum value of a maximum height per length of the second rough surface structure ranges from several micrometers to several centimeters;   a metal ring frame disposed between the first metal layer and the metal substrate, wherein the first rough surface structure, the metal ring frame, and the second rough surface structure define a fluid chamber, and a working fluid flows in the fluid chamber the fluid chamber is in a low vacuum state, and the working fluid is peprformed two-dimensional lateral flow via a capillary action of the first rough surface structure and the second rough surface structure; and   a second metal layer disposed on the upper surface of the heat-conductive material layer, wherein the second metal layer entirely covers or exposes a portion of the heat-conductive material layer, and second metal layer is disposed between the heat generating element and the heat-conductive material layer.   
     
     
         2 . The heat dissipation plate as claimed in  claim 1 , wherein the heat-conductive material layer further comprises at least one conductive through hole structure, and the at least one conductive through hole structure exposes a portion of the first metal layer and is electrically connected to the first metal layer. 
     
     
         3 . The heat dissipation plate as claimed in  claim 1 , further comprising:
 at least one opening penetrating through the heat-conductive material layer and the first metal layer and communicating with the fluid chamber.   
     
     
         4 . The heat dissipation plate as claimed in  claim 1 , further comprising:
 at least one opening penetrating through the metal ring frame and communicating with the fluid chamber.   
     
     
         5 . The heat dissipation plate as claimed in  claim 1 , further comprising:
 at least one opening penetrating through the metal substrate and communicating with the fluid chamber.   
     
     
         6 . The heat dissipation plate as claimed in  claim 1 , wherein a material of the first metal layer, a material of the metal substrate, and a material of the metal ring frame comprise copper, aluminum, or an alloy thereof. 
     
     
         7 . The heat dissipation plate as claimed in  claim 1 , wherein the working fluid comprises air or liquid. 
     
     
         8 . A package structure, comprising:
 a heat generating element;   a heat-conductive material layer having an upper surface and a lower surface opposite to each other, wherein a material of the heat-conductive material layer comprises ceramic or silicon germanium, and a thermal expansion coefficient of the heat-conductive material layer is close to a thermal expansion coefficient of the heat generating element;   a first metal layer disposed on the lower surface of the heat-conductive material layer and having a first rough surface structure, wherein the heat-conductive material layer is disposed between the first metal layer and the heat generating element, the first rough surface structure is a concave-convex surface structure, and a maximum value of a maximum height per length of the first rough surface structure ranges from several micrometers to several centimeters;   a metal substrate disposed below the first metal layer and having a second rough surface structure, wherein the second rough surface structure is a concave-convex surface structure, and a maximum value of a maximum height per length of the second rough surface structure ranges from several micrometers to several centimeters;   a metal ring frame disposed between the first metal layer and the metal substrate, wherein the first rough surface structure, the metal ring frame, and the second rough surface structure define a fluid chamber, and a working fluid flows in the fluid chamber the fluid chamber is in a low vacuum state, and the working fluid is peprformed two-dimensional lateral flow via a capillary action of the first rough surface structure and the second rough surface structure; and   a second metal layer disposed on the upper surface of the heat-conductive material layer, wherein the second metal layer entirely covers or exposes a portion of the heat-conductive material layer, and second metal layer is disposed between the heat generating element and the heat-conductive material layer.