Inventor · disambiguated record
Ching-Sheng Chen
Also filed as: CHEN CHING-SHENG
23 granted patents·17 pending applications·18 citations·filing 2001–2024
91Inventor score
Files withUNIMICRON TECHNOLOGY CORP15CHEN CHING-SHENG8SUBTRON TECHNOLOGY CO LTD5MEDIATEK INC4WANG CHIN-SHENG4
Top patents by PatentIndex Score
40 records- 0177US8973258B2Manufacturing method of substrate structureCHEN CHING-SHENG·Filed 2012·Granted Mar 10, 2015·5 cites·7 claims
- 0274US12052815B2Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Jul 30, 2024·0 cites·15 claims
- 0374US2025056712A1Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0473US9591753B2Circuit board and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2015·Granted Mar 7, 2017·3 cites·10 claims
- 0572US8803295B2Circuit structure and manufacturing method thereofCHEN CHING-SHENG·Filed 2012·Granted Aug 12, 2014·2 cites·7 claims
- 0669US2024282687A1Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0768US9478698B2Light emitting device having a light extraction layerEPISTAR CORP·Filed 2014·Granted Oct 25, 2016·1 cites·14 claims
- 0868US9041166B2Manufacturing method of circuit structureSUBTRON TECHNOLOGY CO LTD·Filed 2014·Granted May 26, 2015·1 cites·6 claims
- 0968US8552303B2Circuit structure and manufacturing method thereofCHEN CHING-SHENG·Filed 2011·Granted Oct 8, 2013·2 cites·8 claims
- 1067US12133323B2Transmission device for suppressing glass fiber effectUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Oct 29, 2024·0 cites·10 claims
- 1165US11785707B2Circuit board and manufacturing method thereof and electronic deviceUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Oct 10, 2023·0 cites·9 claims
- 1263US12177964B2Circuit board and manufacturing method thereof and electronic deviceUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Dec 24, 2024·0 cites·5 claims
- 1363US9036368B2Cable management device in chassisCHEN CHING-SHENG·Filed 2012·Granted May 19, 2015·3 cites·5 claims
- 1462US9747867B2Apparatus and method for performing image content adjustment according to viewing condition recognition result and content classification resultMEDIATEK INC·Filed 2015·Granted Aug 29, 2017·1 cites·22 claims
- 1559US12439529B2Plurality of build-up layers in a circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Oct 7, 2025·0 cites·11 claims
- 1659US12057381B2Circuit board having laminated build-up layersUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Aug 6, 2024·0 cites·9 claims
- 1756US12315981B2Transmission line device compriing first and second conductive lines on one level separated from a third conductive line on another level by an intervening ground layerUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted May 27, 2025·0 cites·17 claims
- 1856US11792918B2Co-axial via structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Oct 17, 2023·0 cites·7 claims
- 1955US12396096B2Circuit board deviceUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 2053US2015144315A1Heat dissipation substrateCHEN CHING-SHENG·Filed 2014·Application pending·0 cites
- 2153US2025287497A1Circuit board deviceUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2252US8853102B2Manufacturing method of circuit structureCHEN CHING-SHENG·Filed 2013·Granted Oct 7, 2014·0 cites·7 claims
- 2352US2012175044A1Manufacturing method of thermal conductivity substrateWANG CHIN-SHENG·Filed 2012·Application pending·0 cites
- 2452US2009215490A1Methods for handling proactive commands for one or more subscriber identity cards and systems utilizing the sameMEDIATEK INC·Filed 2008·Application pending·0 cites
- 2551US11895772B2Interlayer connective structure of wiring board and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Feb 6, 2024·0 cites·8 claims
- 2650US2012070684A1Thermal conductivity substrate and manufacturing method thereofWANG CHIN-SHENG·Filed 2011·Application pending·0 cites
- 2749US9204546B2Circuit board and manufacturing method thereofWANG CHIN-SHENG·Filed 2014·Granted Dec 1, 2015·0 cites·17 claims
- 2848US2008192623A1Methods and devices for dual-tone multi-frequency (dtmf) signalingMEDIATEK INC·Filed 2007·Application pending·0 cites
- 2948US2014345841A1Heat dissipation plateCHEN CHING-SHENG·Filed 2013·Application pending·0 cites
- 3046US11545412B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Jan 3, 2023·0 cites·14 claims
- 3146US2016282055A1Heat dissipation plate and package structureSUBTRON TECHNOLOGY CO LTD·Filed 2016·Application pending·0 cites
- 3246US2022240375A1Co-axial via structure and manufacturing method of the sameUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 3344US2014021154A1Movable lugs and assistance device for removing equipment from rackCHEN CHING-SHENG·Filed 2012·Application pending·0 cites
- 3442US9433099B2Package carrierWANG CHIN-SHENG·Filed 2013·Granted Aug 30, 2016·0 cites·9 claims
- 3542US2008107051A1System and method for operating a portable electronic deviceMEDIATEK INC·Filed 2006·Application pending·0 cites
- 3641US10820411B1Manufacturing method for circuit board and circuit board thereofUNIMICRON TECH CORPORATION·Filed 2020·Granted Oct 27, 2020·0 cites·10 claims
- 3736US2015324209A1Operating System Switching Method and Dual-Operating System Electronic Device Using the SamePEGATRON CORP·Filed 2015·Application pending·0 cites
- 3834US2002093819A1Rapidly directional assembled and water-proof lampFiled 2001·Application pending·0 cites
- 3933US2016095256A1Heat dissipation moduleSUBTRON TECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
- 4031US2017325330A1Manufacturing method of circuit substrateSUBTRON TECHNOLOGY CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →