Heat dissipation substrate

Abstract

A heat dissipation substrate includes a heat sink, a metal base and an elastic structure. The heat sink includes a carrying portion and supporting portions. The supporting portions are parallel to one another and disposed on a lower surface of the carrying portion. The supporting portions are perpendicular to the carrying portion and surround an accommodating space with the carrying portion. The carrying portion has first rough surface structure disposed on a portion of the lower surface and located in the accommodating space. The metal base is disposed below the heat sink and has an assemble surface and a second rough surface structure disposed on a portion of the assemble surface and corresponding to the first rough surface structure. The first and second rough surface structures and the supporting portions define a fluid chamber in which the elastic structure is disposed, and a working fluid flows in the fluid chamber.

What is claimed is: 
     
         1 . A heat dissipation substrate, comprising:
 a heat sink comprising a carrying portion and a plurality of supporting portions, the carrying portion having a carrying surface and a lower surface opposite to each other, the supporting portions being parallel to one another and disposed on the lower surface of the carrying portion, wherein the supporting portions are perpendicular to the carrying portion and surround an accommodating space with the carrying portion, the carrying portion has a first rough surface structure disposed on a portion of the lower surface, and the first rough surface structure is located in the accommodating space;   a metal base disposed below the heat sink and having an assemble surface, wherein the metal base has a second rough surface structure disposed on a portion of the assemble surface and corresponding to the first rough surface structure, the first rough surface structure, the second rough surface structure and the supporting portions define a fluid chamber, and a working fluid flows in the fluid chamber; and   at least one elastic structure disposed within the fluid chamber.   
     
     
         2 . The heat dissipation substrate as recited in  claim 1 , further comprising:
 a plurality of fixing elements disposed between the metal base and the supporting portions of the heat sink so as to fix the metal base on the heat sink.   
     
     
         3 . The heat dissipation substrate as recited in  claim 1 , wherein each of the supporting portions has a first supporting portion and a second supporting portion, the first supporting portion connects the lower surface of the heat sink and the second supporting portion, a thickness of the first supporting portion is greater than a thickness of the second supporting portion, the metal base is located in the accommodating space, and edges of the metal base contact the second supporting portions. 
     
     
         4 . The heat dissipation substrate as recited in  claim 3 , wherein each of the second supporting portions has a first threaded portion, a surrounding surface of the metal base has a second threaded portion, and the first threaded portions and the second threaded portion cooperatively fix the metal base on the supporting portions. 
     
     
         5 . The heat dissipation substrate as recited in  claim 1 , wherein the assemble surface of the metal base contacts an end of each of the supporting portions that is relatively far away from the carrying portion. 
     
     
         6 . The heat dissipation substrate as recited in  claim 1 , wherein the heat sink further comprises a plurality of heat dissipation fins arranged in parallel with each other, and the heat dissipation fins are disposed on the supporting portions and located outside of the accommodating space. 
     
     
         7 . The heat dissipation substrate as recited in  claim 6 , wherein an extending direction of the heat dissipation fins is the same as an extending direction of the carrying portion. 
     
     
         8 . The heat dissipation substrate as recited in  claim 6 , wherein an extending direction of the heat dissipation fins is the same as an extending direction of the supporting portions. 
     
     
         9 . The heat dissipation substrate as recited in  claim 6 , wherein each of the heat dissipation fins has at least one heat dissipation hole, and an extending direction of each of the heat dissipation holes is perpendicular to an extending direction of each of the heat dissipation fins. 
     
     
         10 . The heat dissipation substrate as recited in  claim 1 , wherein the metal base further comprises at least one opening, and the opening penetrates the metal base and connects with the fluid chamber. 
     
     
         11 . The heat dissipation substrate as recited in  claim 1 , wherein the first rough surface structure is a lumpy surface structure, and a Rymax of the first rough surface structure ranges from several micrometers to several centimeters. 
     
     
         12 . The heat dissipation substrate as recited in  claim 1 , wherein the second rough surface structure is a lumpy surface structure, and a Rymax of the second rough surface structure ranges from several micrometers to several centimeters. 
     
     
         13 . The heat dissipation substrate as recited in  claim 1 , wherein the working fluid comprises air or liquid. 
     
     
         14 . The heat dissipation substrate as recited in  claim 1 , wherein the elastic structure is a spring.