US2014345841A1PendingUtilityA1

Heat dissipation plate

48
Assignee: CHEN CHING-SHENGPriority: May 21, 2013Filed: Jul 5, 2013Published: Nov 27, 2014
Est. expiryMay 21, 2033(~6.9 yrs left)· nominal 20-yr term from priority
Inventors:Ching-Sheng Chen
H10W 90/753H10W 40/255H10W 40/73F28F 21/04F28D 15/046
48
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Claims

Abstract

A heat dissipation plate including a heat-conductive material layer, a first metal layer, a metal substrate, and a metal ring frame is provided. The heat-conductive material layer has an upper surface and a lower surface opposite to each other. A material of the heat-conductive material layer includes ceramic or silicon germanium. The first metal layer is disposed on the lower surface of the heat-conductive material layer and has a first rough surface structure. The metal substrate is disposed below the first metal layer and has a second rough surface structure. The metal ring frame is disposed between the first metal layer and the metal substrate. The first rough surface structure, the metal ring frame, and the second rough surface structure define a fluid chamber, and a working fluid flows in the fluid chamber.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A heat dissipation plate comprising:
 a heat-conductive material layer having an upper surface and a lower surface opposite to each other, wherein a material of the heat-conductive material layer comprises ceramic or silicon germanium;   a first metal layer disposed on the lower surface of the heat-conductive material layer and having a first rough surface structure;   a metal substrate disposed below the first metal layer and having a second rough surface structure; and   a metal ring frame disposed between the first metal layer and the metal substrate, wherein the first rough surface structure, the metal ring frame, and the second rough surface structure define a fluid chamber, and a working fluid flows in the fluid chamber.   
     
     
         2 . The heat dissipation plate as claimed in  claim 1 , wherein the heat-conductive material layer further comprises at least one conductive through hole structure, and the at least one conductive through hole structure exposes a portion of the first metal layer and is electrically connected to the first metal layer. 
     
     
         3 . The heat dissipation plate as claimed in  claim 2 , further comprising:
 a second metal layer disposed on the upper surface of the heat-conductive material layer, wherein the second metal layer entirely covers or exposes a portion of the heat-conductive material layer.   
     
     
         4 . The heat dissipation plate as claimed in  claim 1 , further comprising:
 a second metal layer disposed on the upper surface of the heat-conductive material layer, wherein the second metal layer entirely covers or exposes a portion of the heat-conductive material layer.   
     
     
         5 . The heat dissipation plate as claimed in  claim 1 , further comprising:
 at least one opening penetrating through the heat-conductive material layer and the first metal layer and communicating with the fluid chamber.   
     
     
         6 . The heat dissipation plate as claimed in  claim 1 , further comprising:
 at least one opening penetrating through the metal ring frame and communicating with the fluid chamber.   
     
     
         7 . The heat dissipation plate as claimed in  claim 1 , further comprising:
 at least one opening penetrating through the metal substrate and communicating with the fluid chamber.   
     
     
         8 . The heat dissipation plate as claimed in  claim 1 , wherein a material of the first metal layer, a material of the metal substrate, and a material of the metal ring frame comprise copper, aluminum, or an alloy thereof. 
     
     
         9 . The heat dissipation plate as claimed in  claim 1 , wherein the first rough surface structure is a concave-convex surface structure, and a Rymax of the first rough surface structure ranges from several micrometers to several centimeters. 
     
     
         10 . The heat dissipation plate as claimed in  claim 1 , wherein the second rough surface structure is a concave-convex surface structure, and a Rymax of the second rough surface structure ranges from several micrometers to several centimeters. 
     
     
         11 . The heat dissipation plate as claimed in  claim 1 , wherein the working fluid comprises air or liquid.

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