Vapor chamber structure and method of manufacturing same

Abstract

A vapor chamber structure and a method of manufacturing thereof are disclosed. The vapor chamber structure includes a main body formed of a metal plate and a ceramic plate. The metal plate and the ceramic plate are closed each other to define a chamber therebetween; the chamber is internally provided with a wick structure, a support structure, and a working fluid. The metal plate and the ceramic plate are connected each other via welding or a direct bonding copper process, and the support structure is connected to between the metal plate and the ceramic plate via welding or the direct bonding copper process. By contacting the ceramic plate of the vapor chamber with a heat source packaged in a ceramic material to transfer heat, the problem of crack at an interface between the vapor chamber and the heat source due to thermal fatigue can be overcome.

1 . A vapor chamber structure, comprising a main body formed of a metal plate and a ceramic plate; the metal plate and the ceramic plate being correspondingly closed to each other to thereby together define a chamber therebetween; the chamber being internally provided with a wick structure, a support structure, and a working fluid; the wick structure being located on inner wall surfaces of the chamber; and the support structure being connected to between the metal plate and the ceramic plate. 
     
     
         2 . The vapor chamber structure as claimed in  claim 1 , wherein the wick structure is selected from the group consisting of a sintered powder structure, a netlike structure, and a plurality of grooves. 
     
     
         3 . The vapor chamber structure as claimed in  claim 1 , wherein the ceramic plate is made of a material selected from the group consisting of silicon nitride (Si 3 N 4 ), zirconium nitride (ZrO 2 ), and aluminum oxide (Al 2 O 3 ). 
     
     
         4 . The vapor chamber structure as claimed in  claim 1 , wherein the support structure is connected to the ceramic plate and the metal plate in a manner selected from the group consisting of soldering, brazing, diffusion bonding, ultrasonic welding, and direct bonding copper (DBC) process. 
     
     
         5 . The vapor chamber structure as claimed in  claim 1 , wherein the support structure includes a plurality of copper posts. 
     
     
         6 . The vapor chamber structure as claimed in  claim 1 , wherein the metal plate is made of a material selected from the group consisting of a copper material, an aluminum material, a stainless steel material, and any other metal material with good heat radiating and thermal conducting properties. 
     
     
         7 . A method of manufacturing vapor chamber, comprising the following steps:
 (a) providing a metal plate and a ceramic plate;   (b) providing a wick structure and a support structure on faces of the metal plate and the ceramic plate that are to be faced toward each other later; and   (c) correspondingly closing the metal plate and the ceramic plate to each other to define a chamber therebetween, evacuating the chamber, filling a working fluid into the chamber, and sealing a joint between the closed metal plate and ceramic plate to complete a vapor chamber.   
     
     
         8 . The vapor chamber manufacturing method as claimed in  claim 7 , wherein the wick structure is selected from the group consisting of a sintered powder structure, a netlike structure, and a plurality of grooves. 
     
     
         9 . The vapor chamber manufacturing method as claimed in  claim 7 , wherein the ceramic plate is made of a material selected from the group consisting of silicon nitride (Si 3 N 4 ), zirconium nitride (ZrO 2 ), and aluminum oxide (Al 2 O 3 ). 
     
     
         10 . The vapor chamber manufacturing method as claimed in  claim 7 , wherein the support structure is connected to the ceramic plate and the metal plate in a manner selected from the group consisting of soldering, brazing, diffusion bonding, ultrasonic welding, and direct bonding copper (DBC) process. 
     
     
         11 . The vapor chamber manufacturing method as claimed in  claim 7 , wherein the support structure includes a plurality of copper posts. 
     
     
         12 . The vapor chamber manufacturing method as claimed in  claim 7 , wherein, in the step (c), the correspondingly closed metal plate and ceramic plate are connected to each other in a manner selected from the group consisting of soldering, brazing, diffusion bonding, ultrasonic welding, and direct bonding copper (DBC) process.