Inventor · disambiguated record
Hsiu-Wei Yang
Also filed as: YANG HSIU-WEI
36 granted patents·28 pending applications·110 citations·filing 2005–2024
96Inventor score
Files withASIA VITAL COMPONENTS CO LTD36YANG HSIU-WEI24INTERCONTINENTAL GREAT BRANDS LLC2ASIA VITAL COMPONENTS CHINA CO LTD1WU CHUN-MING1
Top patents by PatentIndex Score
64 records- 0194US9700930B2Heat dissipation device and manufacturing method thereofASIA VITAL COMPONENTS CO LTD·Filed 2014·Granted Jul 11, 2017·17 cites·5 claims
- 0293US10112272B2Manufacturing method of vapor chamberASIA VITAL COMPONENTS CO LTD·Filed 2016·Granted Oct 30, 2018·7 cites·6 claims
- 0389US8757247B2Heat pipe structureYANG HSIU-WEI·Filed 2011·Granted Jun 24, 2014·9 cites·9 claims
- 0488US8997839B2Thin heat pipe structure and method of manufacturing sameYANG HSIU-WEI·Filed 2011·Granted Apr 7, 2015·8 cites·7 claims
- 0588US8997840B2Heat-dissipating unit having a hydrophilic compound film and method for depositing a hydrophilic compound filmYANG HSIU-WEI·Filed 2011·Granted Apr 7, 2015·11 cites·14 claims
- 0687US11765861B2Vapor chamber structureASIA VITAL COMPONENTS CO LTD·Filed 2019·Granted Sep 19, 2023·5 cites·10 claims
- 0785US9549486B2Raised bodied vapor chamber structureASIA VITAL COMPONENTS CO LTD·Filed 2013·Granted Jan 17, 2017·4 cites·7 claims
- 0884US9291398B2Micro vapor chamberYANG HSIU-WEI·Filed 2011·Granted Mar 22, 2016·8 cites·10 claims
- 0982US10029337B2Method of manufacturing heat dissipation deviceASIA VITAL COMPONENTS CO LTD·Filed 2015·Granted Jul 24, 2018·2 cites·8 claims
- 1081US9032624B2Plate-type heat pipe sealing structure and manufacturing method thereofASIA VITAL COMPONENTS CO LTD·Filed 2013·Granted May 19, 2015·2 cites·4 claims
- 1181US9021698B2Flat plate heat pipe and method for manufacturing the sameASIA VITAL COMPONENTS CO LTD·Filed 2013·Granted May 5, 2015·3 cites·11 claims
- 1279US9772143B2Thermal moduleASIA VITAL COMPONENTS CO LTD·Filed 2013·Granted Sep 26, 2017·5 cites·8 claims
- 1378US8869878B2Flat plate heat pipe and method for manufacturing the sameYANG HSIU-WEI·Filed 2010·Granted Oct 28, 2014·2 cites·7 claims
- 1475US8985196B2Heat dissipation device with mounting structureYANG HSIU-WEI·Filed 2011·Granted Mar 24, 2015·4 cites·11 claims
- 1574US10352625B2Thermal moduleASIA VITAL COMPONENTS CO LTD·Filed 2014·Granted Jul 16, 2019·1 cites·5 claims
- 1673US9421648B2Manufacturing method of heat pipe structureASIA VITAL COMPONENTS CO LTD·Filed 2013·Granted Aug 23, 2016·1 cites·5 claims
- 1770US10502496B2Micro vapor chamberYANG HSIU WEI·Filed 2010·Granted Dec 10, 2019·3 cites·17 claims
- 1868US7464463B2Method for making a heat dissipating deviceASIA VITAL COMPONENTS CO LTD·Filed 2005·Granted Dec 16, 2008·5 cites·2 claims
- 1968US7461450B2Method for making a heat dissipating deviceASIA VITAL COMPONENTS CO LTD·Filed 2005·Granted Dec 9, 2008·4 cites·3 claims
- 2066US10785894B2Case heat dissipation unit of handheld electronic deviceASIA VITAL COMPONENTS CO LTD·Filed 2018·Granted Sep 22, 2020·1 cites·4 claims
- 2164US2014082943A1Thin heat pipe structure and method of manufacturing sameASIA VITAL COMPONENTS CO LTD·Filed 2013·Application pending·0 cites
- 2263US10101779B2Heat dissipation unit of handheld electronic deviceASIA VITAL COMPONENTS CO LTD·Filed 2013·Granted Oct 16, 2018·1 cites·3 claims
- 2362US2024393060A1Capillary woven mesh structureASIA VITAL COMPONENTS CHINA CO LTD·Filed 2023·Application pending·0 cites
- 2461US9453688B2Heat dissipation unitASIA VITAL COMPONENTS CO LTD·Filed 2013·Granted Sep 27, 2016·1 cites·13 claims
- 2561US9303927B2Heat spreader structure and manufacturing method thereofYANG HSIU-WEI·Filed 2011·Granted Apr 5, 2016·2 cites·5 claims
- 2661US7469740B2Heat dissipating deviceASIA VITAL COMPONENTS CO LTD·Filed 2005·Granted Dec 30, 2008·2 cites·8 claims
- 2760US9903665B2Heat dissipation unit and thermal module thereofASIA VITAL COMPONENTS CO LTD·Filed 2015·Granted Feb 27, 2018·0 cites·3 claims
- 2859US7721439B2Manufacturing system for making a heat dissipating deviceASIA VITAL COMPONENTS CO LTD·Filed 2005·Granted May 25, 2010·2 cites·11 claims
- 2958US2015168078A1Vapor Chamber StructureASIA VITAL COMPONENTS CO LTD·Filed 2013·Application pending·0 cites
- 3058US2015122460A1Heat pipe structureASIA VITAL COMPONENTS CO LTD·Filed 2013·Application pending·0 cites
- 3157US12505389B1Computer systems and methods for determining environment impact indicators for food productsINTERCONTINENTAL GREAT BRANDS LLC·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 3257US10788869B2Heat-conducting case unit for handheld electronic deviceASIA VITAL COMPONENTS CO LTD·Filed 2018·Granted Sep 29, 2020·0 cites·2 claims
- 3357US9879920B2Vapor chamber structureASIA VITAL COMPONENTS CO LTD·Filed 2016·Granted Jan 30, 2018·0 cites·6 claims
- 3456US2014216691A1Vapor chamber structureASIA VITAL COMPONENTS CO LTD·Filed 2013·Application pending·0 cites
- 3556US2014182819A1Heat dissipating deviceASIA VITAL COMPONENTS CO LTD·Filed 2013·Application pending·0 cites
- 3655US12333616B1Computer systems and methods for determining environment impact indicators for food productsINTERCONTINENTAL GREAT BRANDS LLC·Filed 2024·Granted Jun 17, 2025·0 cites·20 claims
- 3754US2014237822A1Heat dissipation unit and manufacturing method thereof and thermal module thereofASIA VITAL COMPONENTS CO LTD·Filed 2014·Application pending·0 cites
- 3853US9802240B2Thin heat pipe structure and manufacturing method thereofASIA VITAL COMPONENTS CO LTD·Filed 2014·Granted Oct 31, 2017·0 cites·5 claims
- 3953US2013126133A1Heat pipe structureWU CHUN-MING·Filed 2011·Application pending·0 cites
- 4053US2013168054A1Heat pipe and method for manufacturing the sameYANG HSIU-WEI·Filed 2012·Application pending·0 cites
- 4151US2014144019A1Heat Dissipation Device and Method of Manufacturing SameASIA VITAL COMPONENTS CO LTD·Filed 2014·Application pending·0 cites
- 4250US2018376620A1Back cover unit applied to handheld electronic device with heat conduction and heat dissipation effectASIA VITAL COMPONENTS CO LTD·Filed 2018·Application pending·0 cites
- 4349US10602642B2Back cover unit applied to portable device and having heat conduction functionASIA VITAL COMPONENTS CO LTD·Filed 2018·Granted Mar 24, 2020·0 cites·6 claims
- 4449US2012305223A1Thin heat pipe structure and manufacturing method thereofYANG HSIU-WEI·Filed 2011·Application pending·0 cites
- 4549US2013008634A1Heat dissipation unit and manufacturing method thereof and thermal module thereofYANG HSIU-WEI·Filed 2011·Application pending·0 cites
- 4648US2013306275A1Heat dissipation structure for heat dissipation deviceYANG HSIU-WEI·Filed 2012·Application pending·0 cites
- 4747US2013098592A1Heat dissipation device and manufacturing method thereofYANG HSIU-WEI·Filed 2011·Application pending·0 cites
- 4847US2013048253A1Heat dissipation device and method of manufacturing sameYANG HSIU-WEI·Filed 2011·Application pending·0 cites
- 4946US10107558B2Thermal moduleASIA VITAL COMPONENTS CO LTD·Filed 2013·Granted Oct 23, 2018·0 cites·13 claims
- 5046US2012312507A1Thin heat pipe structure and manufacturing method thereofYANG HSIU-WEI·Filed 2011·Application pending·0 cites
Showing the top 50 of 64 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Hsiu-Wei Yang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →