Heat dissipating device

Abstract

A heat dissipating device comprises a first body, a second body, and a working fluid, the first body having a first plate and a second plate combining with each other to together define a first chamber, the second body connecting the first body and having a second chamber communicating with the first chamber correspondingly, the working fluid filled in the first chamber and the second chamber. By means of the design of the structure of the present invention and through the circulation of the working fluid between the first chamber and the second chamber, the heat dissipating device of the present invention can achieve the effect of remote heat dissipation.

What is claimed is: 
     
         1 . A heat dissipating device, comprising:
 a first body having a first plate and a second plate disposed opposite to the first plate, the first plate and the second plate combined with each other to together define a first chamber, a first wick structure being formed on the inner wall of the first chamber;   a second body connecting the first body at one end thereof and extending opposite to the first body from the other end thereof, the second body having a second chamber communicating with the first chamber correspondingly, a second wick structure being formed on the inner wall of the second chamber; and   a working fluid filled in the first chamber and the second chamber.   
     
     
         2 . The heat dissipating device according to  claim 1 , wherein the second body further has an upper pipe surface and a lower pipe surface, the upper pipe surface and the lower pipe surface together defining the second chamber. 
     
     
         3 . The heat dissipating device according to  claim 2 , wherein the second body further has an open end at one end thereof, the open end connecting the first plate and the second plate correspondingly. 
     
     
         4 . The heat dissipating device according to  claim 3 , the first body further has a hole connecting the open end correspondingly. 
     
     
         5 . The heat dissipating device according to  claim 1 , wherein the first wick structure is one of sintered powder, mesh, fiber, foam, and porous material. 
     
     
         6 . The heat dissipating device according to  claim 1 , wherein the second wick structure is one of sintered powder, mesh, fiber, and grooves. 
     
     
         7 . The heat dissipating device according to  claim 1 , wherein the first body further has at least one supporting structure, the supporting structure being one of a copper pillar, a sintered powder column and an annulus, two ends of the supporting structure connecting the first plate and the second plate, respectively. 
     
     
         8 . The heat dissipating device according to  claim 2 , wherein the second body further has at least one supporting structure, the supporting structure being one of a copper pillar, a sintered powder column and an annulus. 
     
     
         9 . The heat dissipating device according to  claim 1 , wherein the first body is a heat spreader. 
     
     
         10 . The heat dissipating device according to  claim 1 , wherein the second body is a heat pipe.