Heat dissipation device and manufacturing method thereof

Abstract

A heat dissipation device and a manufacturing method thereof. The heat dissipation device includes a main body and at least one fixing hole. The main body has a first board body and a second board body corresponding to the first board body. The first and second board bodies are mated with each other to define a chamber. A working fluid and multiple support pillars are disposed in the chamber. At least one capillary structure is disposed on a surface of the chamber. The fixing hole is formed on the main body in a position where any support pillar is positioned. The fixing hole passes through the first and second board bodies and the support pillar. According to the above arrangement, the airtightness of the chamber of the main body can be ensured. Also, the heat spreader can be tightly connected with other components.

What is claimed is: 
     
         1 . A heat dissipation device comprising:
 a main body having a first board body and a second board body corresponding to the first board body, the first and second board bodies being mated with each other to define a chamber, the chamber having a first inner side and a second inner side, a working fluid and multiple support pillars being disposed in the chamber, at least one capillary structure being disposed on a surface of the chamber, two ends of the support pillar being connected to the first and second sides of the chamber respectively; and   at least one fixing hole formed on the main body in a position where any support pillar is positioned, the fixing hole passing through the first and second board bodies and the support pillar.   
     
     
         2 . The heat dissipation device as claimed in  claim 1 , wherein the capillary structure is selected from a group consisting of sintered powder body, mesh body and channeled structure. 
     
     
         3 . The heat dissipation device as claimed in  claim 1 , further comprising a fixing member, one end of the fixing member being correspondingly fitted through the fixing hole, the fixing member having a hole formed with an inner thread. 
     
     
         4 . The heat dissipation device as claimed in  claim 1 , wherein at least one raised heated section is disposed on an outer side of the main body in adjacency to the fixing hole. 
     
     
         5 . The heat dissipation device as claimed in  claim 1 , wherein the heat dissipation device is a heat spreader. 
     
     
         6 . The heat dissipation device as claimed in  claim 1 , wherein the main body is correspondingly attached to a substrate, at least one raised heated section being disposed on one side of the main body, a heat sink being connected to the other side of the main body opposite to the heated section, the heated section of the main body contacting at least one heat source on the substrate, multiple fixing bosses being arranged along a periphery of the heat source of the substrate, each fixing boss having an inner thread corresponding to the fixing hole, a fastening member being passed through the fixing hole and the inner thread of the fixing boss to affix the main body onto the substrate. 
     
     
         7 . The heat dissipation device as claimed in  claim 6 , wherein the main body further has at least one fixing member, one end of the fixing member being correspondingly fitted through the fixing hole of the main body, the fixing member having a hole formed with an inner thread, a fastening member being passed through the inner thread of the hole and the inner thread of the fixing boss to affix the main body onto the substrate. 
     
     
         8 . The heat dissipation device as claimed in  claim 1 , wherein the fixing hole has an inner thread. 
     
     
         9 . The heat dissipation device as claimed in  claim 6 , wherein the fixing hole has an inner thread, the fastening member being passed through the inner thread of the fixing hole and the inner thread of the fixing boss to affix the main body onto the substrate. 
     
     
         10 . A manufacturing method of a heat dissipation device, comprising steps of:
 preparing a first board body and a second board body;   disposing at least one capillary structure and multiple support pillars on inner faces of the first and second board bodies;   mating the first and second board bodies with each other to form a heat dissipation device with a chamber, vacuuming the chamber, filling a working fluid into the chamber and sealing the heat dissipation device; and   mechanically processing the first and second board bodies to form a fixing hole in a position where any support pillar is positioned.   
     
     
         11 . The manufacturing method of the heat dissipation device as claimed in  claim 10 , wherein the capillary structure is selected from a group consisting of sintered powder body, mesh body and channeled structure. 
     
     
         12 . The manufacturing method of the heat dissipation device as claimed in  claim 10 , wherein the main body further has a fixing member, one end of the fixing member being correspondingly fitted through the fixing hole, the fixing member having a hole formed with an inner thread. 
     
     
         13 . The manufacturing method of the heat dissipation device as claimed in  claim 10 , wherein the mechanical processing is selected from a group consisting of punching, drilling and milling. 
     
     
         14 . The manufacturing method of the heat dissipation device as claimed in  claim 10 , wherein the capillary structure and the support pillars are connected with the first and second board bodies by means of a process selected from a group consisting of diffusion bonding, sintering and brazing.