Heat dissipation structure for heat dissipation device

Abstract

A heat dissipation structure for heat dissipation device includes a heat dissipation device main body that internally defines a chamber, and the chamber is internally provided with at least a whisker layer and a working fluid. The whisker layer is provided on an inner wall surface of the chamber. By providing the whisker layer in the chamber, it is able to provide largely upgraded capillary effect in the chamber to thereby increase the vapor/liquid cycling efficiency of the working fluid in the heat dissipation device, enabling the latter to have upgraded heat transfer performance.

What is claimed is: 
     
         1 . A heat dissipation structure for heat dissipation device, comprising a heat dissipation device main body internally defining a chamber, the chamber being internally provided with at least a whisker layer and a working fluid, and the whisker layer being continuously provided on an inner wall surface of the chamber. 
     
     
         2 . The heat dissipation structure for heat dissipation device as claimed in  claim 1 , wherein the heat dissipation device main body is a heat pipe, and the chamber includes at least a first, a second and a third section, which are connected to and communicable with one another; and the whisker layer being provided in one of or each of the first, the second, and the third section. 
     
     
         3 . The heat dissipation structure for heat dissipation device as claimed in  claim 1 , wherein the inner wall surface of the chamber is a smooth wall surface. 
     
     
         4 . The heat dissipation structure for heat dissipation device as claimed in  claim 2 , wherein the chamber is further internally provided with a coating, and the coating being selectively provided in any one of the first, the second, and the third section. 
     
     
         5 . The heat dissipation structure for heat dissipation device as claimed in  claim 1 , wherein the heat dissipation device main body is selected from the group consisting of a vapor chamber, a heat pipe, a loop heat pipe, and a heat exchanger. 
     
     
         6 . The heat dissipation structure for heat dissipation device as claimed in  claim 1 , wherein the chamber is further internally provided between the inner wall surface and the whisker layer with a wick structure. 
     
     
         7 . The heat dissipation structure for heat dissipation device as claimed in  claim 6 , wherein the wick structure is selected from the group consisting of a sintered powder structure, a mesh structure, a fibrous structure, a porous structure, and a grooved structure. 
     
     
         8 . The heat dissipation structure for heat dissipation device as claimed in  claim 1 , wherein the heat dissipation device main body is a heat pipe, and the whisker layer being axially extended over the inner wall surface of the chamber of the heat pipe. 
     
     
         9 . The heat dissipation structure for heat dissipation device as claimed in  claim 2 , wherein a portion of the whisker layer provided in the second section of the chamber has a density higher than that of other portions of the whisker layer provided in the first and the third section. 
     
     
         10 . The heat dissipation structure for heat dissipation device as claimed in  claim 2 , wherein a portion of the whisker layer provided in the second section of the chamber has a density lower than that of other portions of the whisker layer provided in the first and the third section. 
     
     
         11 . The heat dissipation structure for heat dissipation device as claimed in  claim 1 , wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends. 
     
     
         12 . The heat dissipation structure for heat dissipation device as claimed in  claim 2 , wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends. 
     
     
         13 . The heat dissipation structure for heat dissipation device as claimed in  claim 3 , wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends. 
     
     
         14 . The heat dissipation structure for heat dissipation device as claimed in  claim 4 , wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends. 
     
     
         15 . The heat dissipation structure for heat dissipation device as claimed in  claim 5 , wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends. 
     
     
         16 . The heat dissipation structure for heat dissipation device as claimed in  claim 6 , wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends. 
     
     
         17 . The heat dissipation structure for heat dissipation device as claimed in  claim 7 , wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends. 
     
     
         18 . The heat dissipation structure for heat dissipation device as claimed in  claim 8 , wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends. 
     
     
         19 . The heat dissipation structure for heat dissipation device as claimed in  claim 9 , wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends. 
     
     
         20 . The heat dissipation structure for heat dissipation device as claimed in  claim 10 , wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends.