US2013056178A1PendingUtilityA1

Ebullient cooling device

31
Assignee: MATSUNAGA ARIHIROPriority: May 19, 2010Filed: May 17, 2011Published: Mar 7, 2013
Est. expiryMay 19, 2030(~3.8 yrs left)· nominal 20-yr term from priority
H10W 40/73F28D 15/0233F28D 15/0283F28F 13/187
31
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Claims

Abstract

An ebullient cooling device includes a chamber, a heat sink, a heat receiving member, and a heat dissipating member. The chamber includes a heat conducting plate with a heat generating body on an outer side surface thereof, and an airtight space filled with coolant that undergoes a phase change between liquid and gas, on an inner side of the heat conducting plate. The heat sink is provided on the outer side surface of the heat conducting plate. The heat receiving member is provided on an inner side surface of the heat conducting plate so as to oppose the heat generating body with the heat conducting plate sandwiched therebetween, and transfers heat generated at the heat generating body to the coolant. The heat dissipating member is provided on the inner side surface of the heat conducting plate, receives heat transferred by the coolant, and dissipates the heat to the heat sink.

Claims

exact text as granted — not AI-modified
1 . An ebullient cooling device comprising:
 a chamber that includes a heat conducting plate with a heat generating body provided on an outer side surface thereof, and an airtight space provided on an inner side of the heat conducting plate, the airtight space filled with a coolant that undergoes a phase change between liquid and gas;   a heat sink that is provided on the outer side surface of the heat conducting plate;   a heat receiving member that is provided on an inner side surface of the heat conducting plate so as to oppose the heat generating body with the heat conducting plate sandwiched therebetween, the heat receiving member transferring heat generated at the heat generating body to the coolant; and   a heat dissipating member that is provided on the inner side surface of the heat conducting plate, the heat dissipating member receiving the heat transferred by the coolant, and dissipating the heat to the heat sink,   the heat receiving member and the heat dissipating member arranged spaced apart from each other in a surface direction of the heat conducting plate, and   the heat receiving member immersed in the coolant in a liquid state.   
     
     
         2 . The ebullient cooling device according to  claim 1 , wherein:
 the heat conducting plate is a heat receiving plate and a heat dissipating plate that are arranged facing each other with the airtight space sandwiched therebetween;   the heat generating body and the heat receiving member are provided on the heat receiving plate; and   the heat sink and the heat dissipating member are provided on the heat dissipating plate.   
     
     
         3 . The ebullient cooling device according to  claim 2 , wherein a height of the heat receiving member from the heat receiving plate and a height of the heat dissipating member from the heat dissipating plate are respectively set to a dimension of approximately one-half a distance between the heat receiving plate and the heat dissipating plate. 
     
     
         4 . The ebullient cooling device according to  claim 2 , wherein:
 the heat receiving member is spaced at least 1 mm or more from an inner side surface of the heat dissipating plate; and   the heat dissipating member is spaced at least 1 mm or more from an inner side surface of the heat receiving plate.   
     
     
         5 . The ebullient cooling device according to  claim 1 , wherein the heat receiving member and the heat dissipating member include a plurality of fins that are installed in a standing manner on the inner side surface of the heat conducting plate. 
     
     
         6 . The ebullient cooling device according to  claim 1 , wherein the heat receiving member and the heat dissipating member are cuboid blocks fixed to the inner side surface of the heat conducting plate. 
     
     
         7 . The ebullient cooling device according to  claim 1 , wherein surface roughening of a surface roughness range of 1 μm to 100 μm is carried out on a surface of the heat receiving member and the heat dissipating member. 
     
     
         8 . The ebullient cooling device according to  claim 1 , wherein the chamber includes a buffer tank in which the coolant in a gas state flows in. 
     
     
         9 . The ebullient cooling device according to  claim 1  wherein the heat receiving member and the heat dissipating member are immersed in the coolant of the liquid state.

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