Method of manufacturing light emitting diode packaging lens and light emmiting diode package

Abstract

A method of manufacturing light emitting diode packaging lens and packages made by using the method are disclosed in the present invention. By using electrophoretic deposition, one or more layers of phosphors are coated onto one surface of a cup which has a curved portion. The cup is used for the packaging lens. Thickness of phosphor layer can be controlled and distribution of phosphor particles is uniform. Therefore, light emitting diode packages with the lens can be a uniform light source.

1 . A method of manufacturing light emitting diode packaging lens, comprising the steps of:
 a) providing a cup having a curved portion;   b) forming a transparent conductive coating on one surface of the cup;   c) providing a first solution having a first group of phosphors for electrophoretic deposition;   d) immersing the cup into the first solution; and   e) providing a current to the transparent conductive coating for electrophoretically depositing the first group of phosphors onto the transparent conductive coating of the cup.   
     
     
         2 . The method according to  claim 1 , wherein the surface shape is hemispherical. 
     
     
         3 . The method according to  claim 1 , wherein the cup is made of epoxy resin, silicone, polyetherimide, fluorocarbon polymer, polymethyl methacrylate (PMMA), polycarbonate (PC), cyclo olefin copolymer (COC) or glass. 
     
     
         4 . The method according to  claim 1 , wherein the transparent conductive coating comprises indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), zinc oxide, tin dioxide, or a mixture thereof. 
     
     
         5 . The method according to  claim 1 , wherein the first solution further comprises a first solvent and a first binder. 
     
     
         6 . The method according to  claim 5 , wherein the first solvent is isopropyl alcohol (IPA), ethanol, acetone, or water. 
     
     
         7 . The method according to  claim 5 , wherein the first binder is silver nitrate or magnesium nitrate. 
     
     
         8 . The method according to  claim 1 , wherein the cup further has a fixing portion formed on rim of the curved portion. 
     
     
         9 . The method according to  claim 8 , wherein the fixing portion is a cylinder having a thickness as that of the cup. 
     
     
         10 . The method according to  claim 2 , wherein a radius of the curved portion of the cup differs from a radius of the first curved electrode by at least one order. 
     
     
         11 . The method according to  claim 1 , further comprising the steps of:
 f) providing a second solution having a second group of phosphors for electrophoretic deposition;   g) immersing the cup into the second solution; and   h) providing a current to the transparent conductive coating for electrophoretically depositing the second group of phosphors onto the first phosphor layer.   
     
     
         12 . The method according to  claim 11 , wherein the second solution further comprises a second solvent and a second binder. 
     
     
         13 . The method according to  claim 12 , wherein the second solvent is isopropyl alcohol (IPA), ethanol, acetone, or water. 
     
     
         14 . The method according to  claim 12 , wherein the second binder is silver nitrate or magnesium nitrate. 
     
     
         15 .- 23 . (canceled)