Boron-comprising inks for forming boron-doped regions in semiconductor substrates using non-contact printing processes and methods for fabricating such boron-comprising inks

Abstract

A method for fabricating a boron-comprising ink is provided. The method includes providing an inorganic boron-comprising material, combining the inorganic boron-comprising material with a polar solvent having a boiling point in a range of from about 50° C. to about 250° C., and combining the inorganic boron-comprising material with a spread-minimizing additive that results in a spreading factor of the boron-comprising ink in a range of from about 1.5 to about 6.

What is claimed is: 
     
         1 . A method for fabricating a boron-comprising ink, the method comprising the steps of:
 providing an inorganic boron-comprising material;   combining the inorganic boron-comprising material with a polar solvent having a boiling point in a range of from about 50° C. to about 250° C.; and   combining the inorganic boron-comprising material with a spread-minimizing additive that results in a spreading factor of the boron-comprising ink in a range of from about 1.5 to about 6.   
     
     
         2 . The method of  claim 1 , wherein the step of providing the inorganic boron-comprising material comprises providing a material selected from the group consisting of boron oxide, boric acid, borates having a formula B(OR) 3 , where R is an alkyl group, and combinations thereof. 
     
     
         3 . The method of  claim 1 , wherein the step of combining the inorganic boron-comprising material with the polar solvent comprises combining the inorganic boron-comprising material with a material selected from the group consisting of iso-stearic acid, ethanol, propylene glycol butyl ether, ethylene glycol, triethylene glycol, and mixtures thereof. 
     
     
         4 . The method of  claim 1 , wherein the step of combining the inorganic boron-comprising material with the spread-minimizing additive comprises combining the inorganic boron-comprising material with a material selected from the group consisting of iso-stearic acid, polypropylene oxide (PPO), vinylmethylsiloxane-dimethylsiloxane copolymer, polyether-modified polysiloxanes, organo-modified polysiloxanes, and combinations thereof. 
     
     
         5 . The method of  claim 1 , further comprising the step of adding a functional additive to the inorganic boron-comprising material, wherein the functional additive comprises a material selected from the group consisting of viscosity modifiers, dispersants, surfactants, polymerization inhibitors, wetting agents, antifoaming agents, detergents and surface-tension modifiers, flame retardants, pigments, plasticizers, thickeners, rheology modifiers, and mixtures thereof. 
     
     
         6 . The method of  claim 1 , further comprising adding a functional additive chosen from viscosity modifiers, dispersants, surfactants, polymerization inhibitors, wetting agents, antifoaming agents, detergents and other surface-tension modifiers, flame retardants, pigments, plasticizers, thickeners, rheology modifiers, or mixtures thereof. 
     
     
         7 . The method of  claim 1 , wherein providing the inorganic boron-comprising material comprises providing a polymeric borazole resin.