Soluble metal salts for use as conductivity promoters

Abstract

The present invention provides conductivity promoters, and in particular soluble conductivity promoters that contain a hydrocarbon moiety or a siloxane moiety and a metal. The present invention also provides methods of making soluble conductivity promoters and adhesive compositions containing the conductivity promoters of the invention.

1 . A soluble conductivity promoter comprising a metal salt, the soluble conductivity promoter including:
 a) a siloxane moiety, and   b) a metal ion.   
     
     
         2 . (canceled) 
     
     
         3 . (canceled) 
     
     
         4 . (canceled) 
     
     
         5 . (canceled) 
     
     
         6 . (canceled) 
     
     
         7 . (canceled) 
     
     
         8 . The soluble conductivity promoter of  claim 1 , wherein the metal salt is a liquid at room temperature. 
     
     
         9 . The soluble conductivity promoter of  claim 1 , wherein the metal salt decomposes at a temperature less than about 220° C. 
     
     
         10 . The soluble conductivity promoter of  claim 1 , wherein the metal salt decomposes at a temperature less than about 200° C. 
     
     
         11 . The soluble conductivity promoter of  claim 1 , wherein the metal ion is selected from the group consisting of Ag, Pd, Ni, Pt, and Au. 
     
     
         12 . The soluble conductivity promoter of  claim 11 , wherein the metal ion is Pd. 
     
     
         13 . A soluble conductivity promoter comprising at least one moiety selected from the group consisting of: 
       
         
           
           
               
               
           
         
       
     
     
         14 . (canceled) 
     
     
         15 . (canceled) 
     
     
         16 . A method of increasing the conductivity of a thermoset resin comprising:
 a) incorporating a soluble conductivity promoter of  claim 1  into the resin; and   b) heating the resin, wherein the conductivity promoter decomposes to generate at least one free metal.   
     
     
         17 . The method of  claim 16 , wherein nano-disperse metal domains are formed within the thermoset resin during step b. 
     
     
         18 . An adhesive composition comprising: a silver flake filled adhesive and a conductivity promoter according to  claim 1 , wherein the silver flake filled adhesive comprises an organic component and a silver flake component. 
     
     
         19 . The adhesive composition of  claim 18 , wherein the organic component comprises about 15% of the total adhesive composition and the conductivity promoter is present at about 0.05% to about 1% of the total weight of the organic component. 
     
     
         20 . The adhesive composition of  claim 19 , wherein the conductivity promoter is present at about 0.6% to about 0.8% of the total weight of the organic component.