Cooling device and power conversion device

Abstract

A heat sink is arranged between a radiator and a circulating pump. A first path length that is a path length between the radiator along a cooling pipe on a side not including the circulating pump and the heat sink and a second path length that is a path length between the circulating pump along the cooling pipe on a side not including the radiator and the heat sink are set to be shorter than a third path length that is a path length between the radiator along the cooling pipe on a side not including the heat sink and the circulating pump. A metal spiral that is a metal material having a high conductivity is spirally wound around the cooling pipe so as to contact an outer circumferential surface of the cooling pipe.

1 . A cooling device of a circulating-liquid cooling system that connects two of respective elements of a heat exchanger, a circulating pump, and a cooled body by a cooling pipe, wherein
 the cooled body is arranged between the heat exchanger and the circulating pump,   each of a first path length that is a path length between the heat exchanger along the cooling pipe on a side not including the circulating pump and the cooled body and a second path length that is a path length between the circulating pump along the cooling pipe on a side not including the heat exchanger and the cooled body is set to be shorter than a third path length that is a path length between the heat exchanger along the cooling pipe on a side not including the cooled body and the circulating pump, and   a metal material having a high thermal conductivity is spirally wound around the cooling pipe so as to contact an outer circumferential surface of the cooling pipe.   
     
     
         2 . A cooling device of a circulating-liquid cooling system that connects two of respective elements of a heat exchanger, a circulating pump, and a cooled body by a cooling pipe, wherein
 the cooled body is arranged between the heat exchanger and the circulating pump,   each of a first path length that is a path length between the heat exchanger along the cooling pipe on a side not including the circulating pump and the cooled body and a second path length that is a path length between the circulating pump along the cooling pipe on a side not including the heat exchanger and the cooled body is set to be shorter than a third path length that is a path length between the heat exchanger along the cooling pipe on a side not including the cooled body and the circulating pump, and   a metal material having a high thermal conductivity is spirally wound around a part of the third path length of the cooling pipe so as to contact an outer circumferential surface of the cooling pipe, and a cooling pipe itself of parts of the first and second path lengths is made of a metal material having a high thermal conductivity.   
     
     
         3 . The cooling device according to  claim 2 , wherein a freezing temperature of a cooling liquid that circulates in the cooling pipe is set to be lower than a minimum temperature in specifications applied to the cooling device. 
     
     
         4 . The cooling device according to  claim 3 , wherein a switching element module that configures the cooled body is formed of a wide bandgap semiconductor. 
     
     
         5 . The cooling device according to  claim 4 , wherein the wide bandgap semiconductor is a semiconductor using silicon carbide, a gallium nitride-based material, or diamond. 
     
     
         6 . (canceled) 
     
     
         7 . A power conversion device that is configured so that a switching element module serving as a cooled body can be cooled by a cooling device of a circulating-liquid cooling system, wherein
 in the cooling device, two of respective elements of a heat exchanger, a circulating pump, and the cooled body are connected by a cooling pipe, and the cooled body is arranged between the heat exchanger and the circulating pump,   each of a first path length that is a path length between the heat exchanger along the cooling pipe on a side not including the circulating pump and the cooled body and a second path length that is a path length between the circulating pump along the cooling pipe on a side not including the heat exchanger and the cooled body is set to be shorter than a third path length that is a path length between the heat exchanger along the cooling pipe on a side not including the cooled body and the circulating pump, and   a metal material having a high thermal conductivity is spirally wound around the cooling pipe so as to contact an outer circumferential surface of the cooling pipe.   
     
     
         8 . A power conversion device that is configured so that a switching element module serving as a cooled body can be cooled by a cooling device of a circulating-liquid cooling system, wherein
 in the cooling device, two of respective elements of a heat exchanger, a circulating pump, and the cooled body are connected by a cooling pipe, and the cooled body is arranged between the heat exchanger and the circulating pump,   each of a first path length that is a path length between the heat exchanger along the cooling pipe on a side not including the circulating pump and the cooled body and a second path length that is a path length between the circulating pump along the cooling pipe on a side not including the heat exchanger and the cooled body is set to be shorter than a third path length that is a path length between the heat exchanger along the cooling pipe on a side not including the cooled body and the circulating pump, and   a metal material having a high thermal conductivity is spirally wound around a part of the third path length of the cooling pipe so as to contact an outer circumferential surface of the cooling pipe, and a cooling pipe itself of parts of the first and second path lengths is made of a metal material having a high thermal conductivity.   
     
     
         9 . The power conversion device according to  claim 8 , wherein a freezing temperature of a cooling liquid that circulates in the cooling pipe is set to be lower than a minimum temperature in specifications applied to the cooling device. 
     
     
         10 . The power conversion device according to  claim 9 , wherein a switching element module that configures the cooled body is formed of a wide bandgap semiconductor. 
     
     
         11 . The power conversion device according to  claim 10 , wherein the wide bandgap semiconductor is a semiconductor using silicon carbide, a gallium nitride-based material, or diamond. 
     
     
         12 . (canceled) 
     
     
         13 . The cooling device according to  claim 1 , wherein the cooled body is a switching element that is applied for a power conversion device. 
     
     
         14 . The cooling device according to  claim 13 , wherein the switching element is formed of a wide bandgap semiconductor. 
     
     
         15 . The cooling device according to  claim 1 , wherein a freezing temperature of a cooling liquid that circulates in the cooling pipe is set to be lower than a minimum temperature in specifications applied to the cooling device. 
     
     
         16 . The cooling device according to  claim 15 , wherein a switching element module that configures the cooled body is formed of a wide bandgap semiconductor. 
     
     
         17 . The cooling device according to  claim 16 , wherein the wide bandgap semiconductor is a semiconductor using silicon carbide, a gallium nitride-based material, or diamond. 
     
     
         18 . The cooling device according to  claim 2 , wherein the cooled body is a switching element that is applied for a power conversion device. 
     
     
         19 . The cooling device according to  claim 18 , wherein the switching element is formed of a wide bandgap semiconductor. 
     
     
         20 . The power conversion device according to  claim 7 , wherein a freezing temperature of a cooling liquid that circulates in the cooling pipe is set to be lower than a minimum temperature in specifications applied to the cooling device. 
     
     
         21 . The power conversion device according to  claim 20 , wherein a switching element module that configures the cooled body is formed of a wide bandgap semiconductor. 
     
     
         22 . The power conversion device according to  claim 21 , wherein the wide bandgap semiconductor is a semiconductor using silicon carbide, a gallium nitride-based material, or diamond.