US2014000655A1PendingUtilityA1

Semiconductor Equipment

51
Assignee: HERMES EPITEK CORPPriority: Feb 1, 2010Filed: Sep 5, 2013Published: Jan 2, 2014
Est. expiryFeb 1, 2030(~3.6 yrs left)· nominal 20-yr term from priority
H10P 72/0428H10P 72/00H10P 72/0412B08B 1/36B08B 1/12A46B 13/00B08B 7/00C23C 16/4405H01L 21/67005
51
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Claims

Abstract

Semiconductor equipment is provided to include a reaction chamber, a movable frame, and at least one cleaning brush head. The cleaning brush head is configured to operate on at least one dirty portion to be cleaned within the reaction chamber. The movable frame is disposed within the reaction chamber. The movable frame is capable of carrying a susceptor. The cleaning brush head is capable of touching the dirty portion. The cleaning brush head is capable of moving relative to the dirty portion for removing the residue which is attached to the portion to be cleaned.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method for cleaning semiconductor equipment, comprising:
 providing semiconductor equipment, said semiconductor equipment having a reaction chamber, wherein at least one dirty portion to be cleaned is positioned within said reaction chamber; and   providing at least one cleaning brush head, said cleaning brush head being provided for touching said dirty portion, and said cleaning brush head being provided for moving relative to said dirty portion to remove residue attached to said dirty portion.   
     
     
         2 . The method for cleaning semiconductor equipment according to  claim 1 , wherein said dirty portion is positioned on an upper portion of said reaction chamber, said cleaning brush head is disposed on said susceptor, said movable frame moves vertically so as to make said cleaning brush head touch said dirty portion, and said movable frame rotates so as to make said cleaning brush head move relative to said dirty portion to remove said residue attached to said dirty portion. 
     
     
         3 . The method for cleaning semiconductor equipment according to  claim 2 , wherein said dirty portion comprises a showerhead. 
     
     
         4 . The method for cleaning semiconductor equipment according to  claim 1 , wherein said cleaning brush head is disposed on a cleaning device, said cleaning device has a driving device, and said driving device makes said cleaning brush head move or rotate. 
     
     
         5 . The method for cleaning semiconductor equipment according to  claim 4 , further comprising a robot arm, wherein said robot arm moves said cleaning device to the inside of said reaction chamber so as to make said cleaning brush head touch said dirty portion. 
     
     
         6 . The method for cleaning semiconductor equipment according to  claim 1 , further comprising a robot arm, wherein said cleaning brush head is disposed on said robot arm, and said robot arm makes said cleaning brush head touch said dirty portion. 
     
     
         7 . The method for cleaning semiconductor equipment according to  claim 6 , wherein said dirty portion is positioned on a lower portion of said reaction chamber, and said movable frame rotates so as to make said cleaning brush head move relative to said dirty portion for removing said residue attached to said dirty portion. 
     
     
         8 . The method for cleaning semiconductor equipment according to  claim 7 , wherein said dirty portion comprises said susceptor.

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