Method for Fabricating Array-Molded Package-on-Package

Abstract

An improved method for fabricating a semiconductor device provides a mold having a top portion and a bottom portion. The top portion includes recesses suitable for a cavity and a plurality of protrusions shaped as truncated cones. A thin sheet of compliant inert polymer is placed over the surface of the top portion. A molding compound is introduced into the cavity to form a encapsulation body covering a semiconductor chip and linear arrays of contact pads adjacent to the chip. Each conical protrusion matches a contact pad location. The thin sheet of compliant inert polymer is peeled off the top portion. The mold is opened and the encapsulated semiconductor chip is removed.

We claim: 
     
         1 . A method for fabricating a semiconductor device, said method comprising:
 providing a mold having a top portion and a bottom portion, the top portion including recesses suitable for a cavity and a plurality of protrusions shaped as truncated cones;   placing a thin sheet of compliant inert polymer over the surface of the top portion;   introducing a molding compound into the cavity to form a encapsulation body covering a semiconductor chip and linear arrays of contact pads adjacent to the chip, each conical protrusion matching a contact pad location;   leaving a conical aperture in the encapsulation body over each contact pad corresponding to a conical protrusion in the cavity;   peeling the thin sheet of compliant inert polymer off the top portion;   opening the mold; and   removing the encapsulated semiconductor chip.   
     
     
         2 . The method of  claim 1 , in which the semiconductor chip is disposed on a substrate. 
     
     
         3 . The method of  1 , in which the molding compound covers a first surface of the substrate on which the semiconductor chip is disposed and does not cover a second surface opposite the first surface. 
     
     
         4 . The method of  claim 3 , in which a plurality of similar semiconductor chip are disposed on the first surface of the substrate. 
     
     
         5 . The method of  claim 4 , further comprising sawing the substrate along saw lines thus singulating the semiconductor chips. 
     
     
         6 . The method of  claim 5 , in which the sawing cuts the substrate and the encapsulating body. 
     
     
         7 . The method of  claim 1 , further comprising filling the apertures with solder material. 
     
     
         8 . The method of  claim 7 , further comprising connecting a packaged second semiconductor device to the solder material. 
     
     
         9 . The method of  claim 8 , further comprising connecting solder material to the second surface of the substrate.