Inventor · disambiguated record
Mark A. Gerber
Also filed as: GERBER MARK · GERBER MARK A · GERBER MARK ALLEN
43 granted patents·29 pending applications·907 citations·filing 1995–2025
98Inventor score
Files withTEXAS INSTRUMENTS INC34ADVANCED SEMICONDUCTOR ENG8DALLAS SEMICONDUCTOR7GERBER MARK A6FREESCALE SEMICONDUCTOR INC4
Top patents by PatentIndex Score
72 records- 0198US7790509B2Method for fine-pitch, low stress flip-chip interconnectTEXAS INSTRUMENTS INC·Filed 2008·Granted Sep 7, 2010·70 cites·15 claims
- 0298US7390700B2Packaged system of semiconductor chips having a semiconductor interposerTEXAS INSTRUMENTS INC·Filed 2006·Granted Jun 24, 2008·69 cites·6 claims
- 0396US7944034B2Array molded package-on-package having redistribution linesTEXAS INSTRUMENTS INC·Filed 2007·Granted May 17, 2011·50 cites·14 claims
- 0495US11342282B2Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 24, 2022·4 cites·26 claims
- 0595US7582963B2Vertically integrated system-in-a-packageTEXAS INSTRUMENTS INC·Filed 2005·Granted Sep 1, 2009·46 cites·5 claims
- 0694US6476506B1Packaged semiconductor with multiple rows of bond pads and method thereforMOTOROLA INC·Filed 2001·Granted Nov 5, 2002·211 cites·9 claims
- 0793US7675152B2Package-on-package semiconductor assemblyTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 9, 2010·115 cites·13 claims
- 0891US8133761B2Packaged system of semiconductor chips having a semiconductor interposerGERBER MARK A·Filed 2009·Granted Mar 13, 2012·19 cites·2 claims
- 0990US7573139B2Packed system of semiconductor chips having a semiconductor interposerTEXAS INSTRUMENTS INC·Filed 2008·Granted Aug 11, 2009·16 cites·4 claims
- 1088US12374631B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 29, 2025·1 cites·14 claims
- 1188US7569918B2Semiconductor package-on-package system including integrated passive componentsTEXAS INSTRUMENTS INC·Filed 2006·Granted Aug 4, 2009·14 cites·16 claims
- 1286US7547630B2Method for stacking semiconductor chipsTEXAS INSTRUMENTS INC·Filed 2007·Granted Jun 16, 2009·15 cites·26 claims
- 1384US8574967B2Method for fabricating array-molded package-on-packageTEXAS INSTRUMENTS INC·Filed 2013·Granted Nov 5, 2013·4 cites·9 claims
- 1484US8304285B2Array-molded package-on-package having redistribution linesGERBER MARK A·Filed 2011·Granted Nov 6, 2012·7 cites·21 claims
- 1581USD384336SPower cap coverDALLAS SEMICONDUCTOR·Filed 1996·Granted Sep 30, 1997·25 cites·1 claims
- 1680US7394900B1Method and apparatus for preventing the interception of data being transmitted to a web site by a monitoring programSOUTHWEST AIRLINES CO·Filed 2003·Granted Jul 1, 2008·38 cites·5 claims
- 1779US9929072B2Packaged semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2015·Granted Mar 27, 2018·2 cites·7 claims
- 1877US6130821AMulti-chip assembly having a heat sink and method thereofMOTOROLA INC·Filed 1998·Granted Oct 10, 2000·51 cites·14 claims
- 1976US10177099B2Semiconductor package structure, package on package structure and packaging methodADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jan 8, 2019·4 cites·21 claims
- 2076US5759049AElectrical contact clipDALLAS SEMICONDUCTOR·Filed 1996·Granted Jun 2, 1998·36 cites·17 claims
- 2175US6916682B2Semiconductor package device for use with multiple integrated circuits in a stacked configuration and method of formation and testingFREESCALE SEMICONDUCTOR INC·Filed 2001·Granted Jul 12, 2005·25 cites·22 claims
- 2274US2025174898A1Antenna deviceADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 2371US7573137B2Controlling flip-chip techniques for concurrent ball bonds in semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2006·Granted Aug 11, 2009·4 cites·9 claims
- 2470US9129955B2Semiconductor flip-chip system having oblong connectors and reduced trace pitchesCASTRO ABRAM M·Filed 2009·Granted Sep 8, 2015·4 cites·17 claims
- 2570USD383438SPower module coverDALLAS SEMICONDUCTOR·Filed 1996·Granted Sep 9, 1997·16 cites·1 claims
- 2668US12206185B2Antenna deviceADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jan 21, 2025·0 cites·20 claims
- 2768US7776653B2Controlling flip-chip techniques for concurrent ball bonds in semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2009·Granted Aug 17, 2010·3 cites·9 claims
- 2867US9257341B2Method and structure of packaging semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2014·Granted Feb 9, 2016·1 cites·6 claims
- 2967US6879028B2Multi-die semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Apr 12, 2005·15 cites·23 claims
- 3064US9978667B2Semiconductor package with lead frame and recessed solder terminalsTEXAS INSTRUMENTS INC·Filed 2014·Granted May 22, 2018·1 cites·15 claims
- 3160US7655552B2Double density method for wirebond interconnectTEXAS INSTRUMENTS INC·Filed 2006·Granted Feb 2, 2010·1 cites·2 claims
- 3259US8430969B2Method for exposing and cleaning insulating coats from metal contact surfacesGERBER MARK A·Filed 2010·Granted Apr 30, 2013·1 cites·9 claims
- 3356US7078808B2Double density method for wirebond interconnectTEXAS INSTRUMENTS INC·Filed 2004·Granted Jul 18, 2006·5 cites·6 claims
- 3456US2014030851A1Method for Fabricating Array-Molded Package-on-PackageTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 3555US2024112978A1Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 3655US2008284045A1Method for Fabricating Array-Molded Package-On-PackageTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 3755US2008315387A1Semiconductor Package-on-Package System Including Integrated Passive ComponentsTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 3854US11146234B2Electrical device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 12, 2021·0 cites·18 claims
- 3954US6858932B2Packaged semiconductor device and method of formationFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Feb 22, 2005·7 cites·21 claims
- 4054US2005288973A1System and method for changing a travel itineraryTAYLOR STEVEN F·Filed 2004·Application pending·0 cites
- 4153US10510643B2Semiconductor package with lead frame and recessed solder terminalsTEXAS INSTRUMENTS INC·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 4252US11862587B2Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 2, 2024·0 cites·14 claims
- 4352US8041036B1Method and apparatus for preventing the interception of data being transmitted to a web site by a monitoring programSOUTHWEST AIRLINES CO·Filed 2008·Granted Oct 18, 2011·1 cites·20 claims
- 4452US2021246472A1Down-regulation of the cytosolic dna sensor pathwaySIGMA ALDRICH CO LLC·Filed 2019·Application pending·0 cites
- 4551US6847102B2Low profile semiconductor device having improved heat dissipationFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jan 25, 2005·7 cites·14 claims
- 4651US6020634AReplaceable power moduleDALLAS SEMICONDUCTOR·Filed 1998·Granted Feb 1, 2000·14 cites·20 claims
- 4751US2011165731A1Method for Fabricating Array-Molded Package-on-PackageTEXAS INSTRUMENTS INC·Filed 2011·Application pending·0 cites
- 4850US2015147845A1Dual sided embedded die and fabrication of same backgroundTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 4947US2010072600A1Fine-pitch oblong solder connections for stacking multi-chip packagesTEXAS INSTRUMENTS INC·Filed 2009·Application pending·0 cites
- 5047US2010084755A1Semiconductor Chip Package System Vertical InterconnectGERBER MARK ALLEN·Filed 2008·Application pending·0 cites
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →