Method of manufacturing heat dissipating base, heat dissipating base and heat dissipating device

Abstract

A method of manufacturing a heat dissipating base includes steps of providing a first base, wherein the first base is made of a first heat conducting material; putting the first base into a mold; pouring a second heat conducting material, which is melted, into the mold, wherein a thermal conductivity of the first heat conducting material is larger than that of the second heat conducting material; and processing the second heat conducting material by a die casting process, so as to form a second base, wherein the second base covers a periphery of the first base and an upper surface and a lower face of the first base are exposed.

What is claimed is: 
     
         1 . A method of manufacturing a heat dissipating base comprising steps of:
 providing a first base, wherein the first base is made of a first heat conducting material;   putting the first base into a mold;   pouring a second heat conducting material, which is melted, into the mold, wherein a thermal conductivity of the first heat conducting material is larger than a thermal conductivity of the second heat conducting material; and   processing the second heat conducting material by a die casting process, so as to form a second base, wherein the second base covers a periphery of the first base and an upper surface and a lower face of the first base are exposed.   
     
     
         2 . The method of  claim 1 , wherein the first heat conducting material is copper and the second heat conducting material is aluminum. 
     
     
         3 . The method of  claim 1 , wherein the periphery of the first base has an engaging structure and the engaging structure is engaged with the second base during the die casting process. 
     
     
         4 . The method of  claim 3 , wherein the engaging structure is a groove. 
     
     
         5 . The method of  claim 1 , wherein a plurality of fixing grooves is formed on a side of the first base and the second base. 
     
     
         6 . The method of  claim 1 , wherein a plurality of fixing holes is formed on the second base. 
     
     
         7 . A heat dissipating base comprising:
 a first base made of a first heat conducting material; and   a second base formed by a die casting process using a second heat conducting material, which is melted during the die casting process, the second base covering a periphery of the first base, an upper surface and a lower face of the first base being exposed, a thermal conductivity of the first heat conducting material being larger than a thermal conductivity of the second heat conducting material.   
     
     
         8 . The heat dissipating base of  claim 7 , wherein the first heat conducting material is copper and the second heat conducting material is aluminum. 
     
     
         9 . The heat dissipating base of  claim 7 , wherein the periphery of the first base has an engaging structure and the engaging structure is engaged with the second base during the die casting process. 
     
     
         10 . The heat dissipating base of  claim 9 , wherein the engaging structure is a groove. 
     
     
         11 . The heat dissipating base of  claim 7 , wherein a plurality of fixing grooves is formed on a side of the first base and the second base. 
     
     
         12 . The heat dissipating base of  claim 7 , wherein a plurality of fixing holes is formed on the second base. 
     
     
         13 . A heat dissipating device comprising:
 a heat dissipating base comprising:
 a first base made of a first heat conducting material; and 
 a second base formed by a die casting process using a second heat conducting material, which is melted during the die casting process, the second base covering a periphery of the first base, an upper surface and a lower face of the first base being exposed, a thermal conductivity of the first heat conducting material being larger than a thermal conductivity of the second heat conducting material; and 
   a plurality of heat dissipating members disposed on the heat dissipating base.   
     
     
         14 . The heat dissipating device of  claim 13 , wherein a plurality of fixing grooves is formed on a side of the first base and the second base, and the heat dissipating members are heat pipes fixed in the fixing grooves. 
     
     
         15 . The heat dissipating device of  claim 13 , wherein the heat dissipating members are heat dissipating fins fixed on the first base. 
     
     
         16 . The heat dissipating device of  claim 13 , wherein the first heat conducting material is copper and the second heat conducting material is aluminum. 
     
     
         17 . The heat dissipating device of  claim 13 , wherein the periphery of the first base has an engaging structure and the engaging structure is engaged with the second base during the die casting process. 
     
     
         18 . The heat dissipating device of  claim 17 , wherein the engaging structure is a groove. 
     
     
         19 . The heat dissipating device of  claim 13 , wherein a plurality of fixing holes is formed on the second base.