US2014113533A1PendingUtilityA1
Damper for polishing pad conditioner
Est. expiryOct 18, 2032(~6.3 yrs left)· nominal 20-yr term from priority
H10P 52/00B24B 53/017B24B 41/007
43
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Claims
Abstract
A conditioner apparatus for use in substrate polishing includes a conditioner head constructed to receive an end effector for conditioning a surface of a polishing pad, an arm that supports the conditioner head, a base that supports the arm, and a damper system secured to the base. The base includes an actuator connected to the arm to move the arm and the conditioner head laterally over the polishing pad. The damper system is configured to reduce vibration of the arm.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A conditioner apparatus for use in substrate polishing, comprising:
a conditioner head constructed to receive an end effector for conditioning a surface of a polishing pad; an arm that supports the conditioner head; a base that supports the arm, the base including an actuator connected to the arm to move the arm and the conditioner head laterally over the polishing pad; and a damper system secured to the base, the damper system configured to reduce vibration of the arm.
2 . The apparatus of claim 1 , wherein the actuator comprises a rotary actuator configured to sweep the arm over the polishing pad.
3 . The apparatus of claim 2 , wherein the damper system is secured to and rotates with the rotary actuator.
4 . The apparatus of claim 1 , wherein the damper system comprises a damper mass.
5 . The apparatus of claim 4 , wherein the damper mass is attached to the base by at least one damper.
6 . The apparatus of claim 5 , wherein the at least one damper comprises a layer of damping material.
7 . The apparatus of claim 4 , wherein the damper mass is attached to the base by a plurality of dampers.
8 . The apparatus of claim 7 , wherein the plurality of dampers comprise dashpots.
9 . The apparatus of claim 7 , wherein the plurality of dampers are arranged to define a primary axis parallel to an axis of a primary mode of vibration of the arm.
10 . The apparatus of claim 7 , wherein the plurality of dampers are arranged to define a primary axis parallel to a longitudinal axis of the arm.
11 . The apparatus of claim 1 , comprising a vertical actuator in the conditioner head and connected to the end effector to control a vertical position of the end effector.
12 . A polishing system, comprising:
a rotatable platen to support a polishing pad; a carrier head to hold a substrate against the polishing pad; a conditioner apparatus including
a conditioner head constructed to receive an end effector for conditioning a surface of the polishing pad,
an arm that supports the conditioner head,
a base that supports the arm, the base including an actuator connected to the arm to move the arm and the conditioner head laterally over the polishing pad, and
a damper system secured to the base, the damper system configured to reduce vibration of the arm.
13 . The system of claim 12 , wherein the base and the platen are mounted on a common frame.
14 . The system of claim 12 , wherein the platen is rotatable about an axis, and the actuator is configured to move the conditioner head toward and away from the axis.
15 . The system of claim 14 , wherein the actuator comprises a rotary actuator configured to sweep the arm over the polishing pad.
16 . The system of claim 12 , wherein the damper system is secured to and rotates with the rotary actuator.
17 . The system of claim 12 , wherein the damper mass is attached to the base by a plurality of dampers.
18 . The system of claim 17 , wherein the plurality of dampers comprise dashpots.
19 . The system of claim 17 , wherein the plurality of dampers are arranged to define a primary axis parallel to an axis of a primary mode of vibration of the arm.
20 . The system of claim 17 , wherein the plurality of dampers are arranged to define a primary axis parallel to a longitudinal axis of the arm.Cited by (0)
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