US2014139258A1PendingUtilityA1

Built off testing apparatus

Assignee: SAMSUNG ELECTRONICS CO LTDPriority: May 13, 2009Filed: Jan 28, 2014Published: May 22, 2014
Est. expiryMay 13, 2029(~2.8 yrs left)· nominal 20-yr term from priority
H10P 74/00G01R 31/31915G01R 31/3183G01R 31/26G11C 29/56G01R 31/2831G01R 31/31922
47
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A built off testing apparatus coupled between a semiconductor device and an external testing apparatus to test a semiconductor device. The built off testing apparatus can include a frequency multiplying unit to generate a test clock frequency by multiplying the frequency of a clock input by the external testing apparatus according to the operation speed of the semiconductor device, an instruction decoding unit to generate test information by decoding test signals input by the external testing apparatus according to the test clock frequency, and a test execution unit to test the semiconductor device according to the test information, and can determine whether the semiconductor device is failed or not based on test data output by the semiconductor device, and can transmit resulting data to the external testing apparatus.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method of testing a semiconductor device, comprising:
 generating a test signal frequency from a clock frequency of an external testing apparatus according to an operation speed of the semiconductor device;   generating test information from a test signal of the external testing apparatus according to the test signal frequency; and   inputting the test information to the semiconductor device according to the test signal frequency to determine whether the semiconductor device is failed.   
     
     
         2 . The method of  claim 1 , further comprising:
 receiving result data from the semiconductor device based on the input test information; and   transmitting the result data to the external testing apparatus according to the clock frequency of the external testing apparatus.   
     
     
         3 . The method of  claim 1 , further comprising:
 comparing output values of the semiconductor device to expected output values according to the test signal frequency to determine whether the semiconductor device is failed.   
     
     
         4 . The method of  claim 1 , wherein the generating a test signal frequency comprises multiplying the clock signal according to the operating speed of the semiconductor device. 
     
     
         5 . The method of  claim 1 , wherein the generating test information comprises decoding testing information of the external testing apparatus according to the test signal frequency.

Join the waitlist — get patent alerts

Track US2014139258A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.