Method for manufacturing an electronic module and an electronic module

Abstract

This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component is glued to the surface of a conductive layer, from which conductive layer conductive patterns are later formed. After gluing the component, an insulating-material layer, which surrounds the component attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component, feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones of the component. After this, conductive patterns are made from the conductive layer, to the surface of which the component is glued.

1 . A method for manufacturing an electronic module, the method comprising:
 taking a conductive layer,   taking a component, which has a contact surface, which has contact zones,   gluing the component, from the side of the contact surface, to the first surface of the conductive layer,   making an insulating-material layer, which surrounds the component glued to the conductive layer, on the first surface of the conductive layer,   making feed-throughs for connecting the contact zones of the component electrically to the conductive layer, and   making conductive patterns from the conductive layer.   
     
     
         2 . A method according to  claim 1 , in which, when gluing the component:
 an adhesive layer is spread on the surface of the conductive layer, and   the contact surface of the component is pressed into the adhesive layer.   
     
     
         3 . A method according to  claim 1 , in which, when gluing the component:
 adhesive layers are spread on the contact surface of the component and the first surface of the conductive layer, and   the adhesive layers are pressed against each other.   
     
     
         4 . A method according to  claim 2 , in which at least one component is glued to the conductive layer and an adhesive layer is spread on areas of the surface of the conductive layer, in such a way that the surface of the conductive layer is essentially free of adhesive outside of the connection zones of the components. 
     
     
         5 . A method according to  claim 1 , in which, when gluing the component:
 an adhesive layer is spread on the contact surface of the component, and   the adhesive layer on the surface of the component is pressed against the conductive layer.   
     
     
         6 . A method according to  claim 1 , in which
 at least one alignment mark is made on the conductive layer, for the alignment of a component, and   the component is glued to the conductive layer, aligned relative to the at least one alignment mark.   
     
     
         7 . A method according to  claim 6 , in which at least one alignment mark is a through hole, which penetrates the conductive layer. 
     
     
         8 . A method according to  claim 1 , in which conductive patterns are made from the conductive layer by removing part of the material of the conductive layer, so that the remaining material forms the conductive patterns. 
     
     
         9 . A method according to  claim 1 , in which openings are made in the conductive layer and the adhesive layer at the position of the contact zones of the component, in order to form feed-throughs. 
     
     
         10 . A method according to  claim 1 , in which a support layer is attached to the conductive layer, and is removed after the manufacture of the insulating-material layer, but before the manufacture of the conductive patterns. 
     
     
         11 . A method according to  claim 1 , in which the insulating-material layer surrounding the component is manufactured by attaching an insulating-material layer, in which recesses or cavities for a component or components have been made, to the conductive layer. 
     
     
         12 . A method according to  claim 11 , in which a second insulating-material layer, which is unified and which covers the component, is attached to the surface of the first insulating-material layer attached to the conductive layer. 
     
     
         13 . A method according to  claim 1 , in which a second conductive-pattern layer is manufactured on the opposite surface of the insulating-material layer. 
     
     
         14 . A method according to  claim 1 , in which a separate component, which is not connected to a circuit-board structure, is glued to the conductive layer. 
     
     
         15 . A method according to  claim 1 , in which more than one component is embedded in the electronic module in a corresponding manner. 
     
     
         16 . A method according to  claim 15 , in which the components embedded in the base are connected electrically to each other, in order to form a functional totality. 
     
     
         17 . A method according to  claim 1 , in which a first module is manufactured along with at least one second module and the manufactured modules are attached to each other one on top of the other, so that the modules are aligned relative to each other. 
     
     
         18 . A method according to  claim 17 , in which holes for feed-throughs are made through the modules that are attached on top of each other and conductors are made in the holes thus created, in order to connect the electronic circuits on each of the modules to each other to form a functional totality.