Integrated circuit protected from short circuits caused by silicide

Abstract

An integrated circuit is formed on a semiconductor substrate and includes a trench conductor and a first transistor formed on the surface of the substrate. The transistor includes: a transistor gate structure, a first doped region extending in the substrate between a first edge of the gate structure and an upper edge of the trench conductor, and a first spacer formed on the first edge of the gate structure and above the first doped region. The first spacer completely covers the first doped region and a silicide is present on the trench conductor but is not present on the surface of the first doped region.

1 . An integrated circuit, comprising:
 a trench conductor that includes:
 a trench formed in a semiconductor substrate; 
 an isolating layer on sidewalls of the trench; and 
 a semiconductor material filling the trench; 
   a first transistor formed on a surface of the substrate, the transistor including:
 a transistor gate structure; 
 a first doped region extending in the substrate between a first edge of the gate structure and an upper edge of the trench conductor; and 
 a first spacer formed on the first edge of the gate structure and above the first doped region, the first spacer completely covering a surface the first doped region, extending beyond the first doped region, and overlapping the insulating layer; and 
   a silicide layer on a surface of the semiconductor material of the trench conductor but is not present on the surface of the first doped region.   
     
     
         2 . The integrated circuit according to  claim 1 , further comprising:
 a second doped region extending in the substrate from a second edge of the gate structure, the second edge being on an opposite side of the gate structure with respect to the first edge; and   a second spacer formed on the second edge of the gate structure and above the second doped region.   
     
     
         3 . The integrated circuit according to  claim 2 , wherein the first spacer has a length greater than a length of the second spacer. 
     
     
         4 . The integrated circuit according to  claim 3 , wherein the first spacer is approximately twice as long as the second spacer. 
     
     
         5 . The integrated circuit according to  claim 3 , wherein the first spacer is a double-spacer structure comprising a first portion that partially covers the first doped region and a second portion that covers the remainder of the first doped region. 
     
     
         6 . The integrated circuit according to  claim 2 , comprising a contact formed on the second doped region, wherein a first distance between the first edge of the transistor gate structure and the upper edge of the trench conductor is approximately half of a second distance between the second edge of the transistor gate structure and the contact. 
     
     
         7 . The integrated circuit according to  claim 6 , wherein the first spacer has a length greater than or equal to the first distance, and the second spacer has approximately the same length as the first spacer. 
     
     
         8 . The integrated circuit according to  claim 2 , comprising a contact formed on the second doped region, wherein a first distance between the first edge of the transistor gate structure and the upper edge of the trench conductor is approximately equal to a second distance between the second edge of the transistor gate structure and the contact. 
     
     
         9 . The integrated circuit according to  claim 2 , wherein the second doped region comprises a shallow, lightly doped portion and a deeper, more highly doped portion, and the first doped region only comprises a shallow, lightly doped portion. 
     
     
         10 . The integrated circuit according to  claim 2 , wherein a silicide is also present on at least one of the control gate and the second doped region. 
     
     
         11 . The integrated circuit according to  claim 1 , comprising a second transistor the includes:
 a buried gate formed by the trench conductor;   a source or drain region formed by a third doped region that extends along lower edges of the buried gate; and   a first vertical channel extending on one side of the buried gate, between the first and the third doped regions.   
     
     
         12 . The integrated circuit according to  claim 11 , wherein the first transistor is a first charge storage transistor and the second transistor is a first selection transistor, the transistors forming a first memory cell. 
     
     
         13 . The integrated circuit according to  claim 12 , further comprising a second memory cell comprising a second charge storage transistor formed on the surface of the substrate on the opposite side of the trench conductor and a selection transistor comprising a second vertical channel extending on an opposite side of the trench conductor with respect to the first vertical channel, the trench conductor forming a common buried gate of the first and second memory cells. 
     
     
         14 . A device comprising:
 an integrated circuit that includes:
 a trench conductor that includes:
 a trench formed in a semiconductor substrate; 
 an isolating layer on sidewalls of the trench; and 
 a semiconductor material filling the trench; 
 
 a first transistor formed on a surface of the substrate, the transistor including:
 a transistor gate structure; 
 a first doped region extending in the substrate between a first edge of the gate structure and an upper edge of the trench conductor; and 
 a first spacer formed on the first edge of the gate structure and above the first doped region, the first spacer completely covering a surface the first doped region, extending beyond the first doped region, and overlapping the insulating layer; and 
 
 a silicide layer on a surface of the semiconductor material of the trench conductor but is not present on the surface of the first doped region. 
   
     
     
         15 . The device according to  claim 14 , wherein the integrated circuit includes:
 a second doped region extending in the substrate from a second edge of the gate structure, the second edge being on an opposite side of the gate structure with respect to the first edge; and   a second spacer formed on the second edge of the gate structure and above the second doped region.   
     
     
         16 . The device according to  claim 15 , wherein the integrated circuit includes a contact formed on the second doped region, wherein a first distance between the first edge of the transistor gate structure and the upper edge of the trench conductor is approximately equal to a second distance between the second edge of the transistor gate structure and the contact. 
     
     
         17 . The device according to  claim 16 , wherein the first spacer is a double-spacer structure comprising a first portion that partially covers the first doped region and a second portion that covers the remainder of the first doped region. 
     
     
         18 . The device according to  claim 15 , wherein the first spacer has a length greater than a length of the second spacer. 
     
     
         19 . The device according to  claim 14 , wherein the integrated circuit includes a second transistor the includes:
 a buried gate formed by the trench conductor;   a source or drain region formed by a third doped region that extends along lower edges of the buried gate; and   a first vertical channel extending on one side of the buried gate, between the first and the third doped regions.   
     
     
         20 . A method, comprising:
 fabricating an integrated circuit, the fabricating including:
 forming a trench in a semiconductor substrate; 
 forming an isolating layer on sidewalls of the trench; 
 filling the trench with a semiconductor material to form a trench conductor; 
 forming a first transistor gate structure on a surface of the substrate; 
 implanting a first doped region extending between a first edge of the gate structure and an upper edge of the trench conductor; 
 forming a first spacer on the first edge of the gate structure and above the first doped region, wherein the first spacer completely covers the first doped region, extends beyond the first doped region, and overlaps the insulating layer; and 
 forming a silicide on the top surface of the semiconductor material of the trench conductor while the first spacer prevents the first doped region from being silicided. 
   
     
     
         21 . The method according to  claim 20 , wherein the fabricating includes:
 implanting a second doped region extending from a second edge of the gate structure, the second edge being on an opposite side of the gate structure with respect to the first edge; and   forming a second spacer on the second edge of the gate structure and above the second doped region.   
     
     
         22 . The method according to  claim 21 , wherein the first spacer has a length greater than a length of the second spacer. 
     
     
         23 . The method according to  claim 21 , wherein the trench conductor is a buried gate of a second transistor, the fabricating including forming a third doped region extending along lower edges of the buried gate and forming a source or drain region of the second transistor, such that the second transistor has a vertical channel extending on one side of the buried gate, between the first and the third doped regions. 
     
     
         24 . The method according to  claim 23 , wherein forming the first spacer includes forming the first spacer only partially covering the first doped region, the fabricating including:
 removing the second spacer;   forming a third spacer covering a portion of the first doped region not covered by the first spacer; and   forming a fourth spacer above the second doped region.   
     
     
         25 . The method according to  claim 21 , wherein forming the first and second spacers includes:
 depositing a uniform spacer layer; and   patterning and etching the uniform spacer layer to form the first and second spacers.   
     
     
         26 . The method according to  21 , wherein the fabricating includes implanting dopants into the second doped region, without implanting dopants into the first doped region.