Substrate electroplating jig

Abstract

A substrate plating jig including a first plate-shaped holding member and a second holding member including a ring-shaped seal packing, including an internal circumferential part, an external circumferential part, and an opening formed at the center of the ring-shaped seal packing. Leading edges of the internal circumferential part and external circumferential part of the ring-shaped seal packing come in close contact with a substrate surface-to-be plated and the first holding member, respectively. The edge of the substrate-to-be-plated is held between the internal circumferential part and the external circumferential part of the ring-shaped seal packing. The substrate surface-to-be-plated is exposed in the opening. A first ring-shaped conducting member includes multiple protruding contact points inside the ring-shaped seal packing, and the substrate surface-to-be-plated comes in contact with the protruding contact points inside the ring-shaped seal packing by interposing and clamping the substrate-to-be-plated between the first holding member and the second holding member.

1 - 5 . (canceled) 
     
     
         6 . A substrate plating jig comprising:
 a first plate-shaped holding member; and   a second holding member including a ring-shaped seal packing including an internal circumferential part and an external circumferential part and an opening formed at the center of the ring-shaped seal packing,   wherein a substrate-to-be-plated is interposed and clamped between the first holding member and the second holding member so as to be held therebetween, so that leading edges of the internal circumferential part and the external circumferential part of the ring-shaped seal packing come into close contact with a substrate surface-to-be-plated and the first holding member, respectively, and an edge of the substrate-to-be-plated is held between the internal circumferential part and the external circumferential part of the ring-shaped seal packing, and the substrate surface-to-be-plated is exposed in the opening; and   a second conducting member or a fourth conducting member configured to conduct electricity with an external electrode is provided on the first holding member, a first ring-shaped conducting member having multiple protruding contact points is provided inside the ring-shaped seal packing, the substrate-to-be-plated is interposed and clamped between the first holding member and the second holding member so as to be held therebetween, whereby the substrate surface-to-be-plated and the protruding contact points come into contact with each other inside the ring-shaped seal packing.   
     
     
         7 . The substrate plating jig according to  claim 6 , wherein the substrate-to-be-plated is interposed and clamped between the first holding member and the second holding member so as to be held therebetween, whereby the first ring-shaped conducting member having multiple protruding contact points and the second conducting member come into contact with each other inside the ring-shaped seal packing and electricity is conducted. 
     
     
         8 . The substrate plating jig according to  claim 6 , wherein contact between the first conducting member and the second conducting member is achieved by sliding contact. 
     
     
         9 . The substrate plating jig according to  claim 6 , wherein the fourth conducting member is connected directly to the first ring-shaped conducting member having multiple protruding contact points via wiring, and electricity is conducted. 
     
     
         10 . The substrate plating jig according to  claim 6 , wherein the first plate-shaped holding member and the second holding member are connected by a hinge mechanism. 
     
     
         11 . The substrate plating jig according to  claim 9 , wherein the fourth conducting member is bent or expanded and contracted to be accommodated inside the ring-shaped seal packing when the substrate-to-be-plated is interposed and clamped between the first holding member and the second holding member so as to be held therebetween.