Inventor · disambiguated record
Junichiro Yoshioka
Also filed as: YOSHIOKA JUNICHIRO
26 granted patents·8 pending applications·308 citations·filing 1998–2016
96Inventor score
Top patents by PatentIndex Score
34 records- 0193US7402227B2Plating apparatus and methodEBARA CORP·Filed 2004·Granted Jul 22, 2008·34 cites·30 claims
- 0292US7022211B2Semiconductor wafer holder and electroplating system for plating a semiconductor waferEBARA CORP·Filed 2001·Granted Apr 4, 2006·47 cites·9 claims
- 0390US7901551B2Substrate holder and plating apparatusEBARA CORP·Filed 2009·Granted Mar 8, 2011·5 cites·7 claims
- 0490US6844274B2Substrate holder, plating apparatus, and plating methodEBARA CORP·Filed 2003·Granted Jan 18, 2005·39 cites·6 claims
- 0589US7833393B2Semiconductor wafer holder and electroplating system for plating a semiconductor waferEBARA CORP·Filed 2006·Granted Nov 16, 2010·11 cites·14 claims
- 0688US8337680B2Substrate holder and plating apparatusYOSHIOKA JUNICHIRO·Filed 2011·Granted Dec 25, 2012·3 cites·9 claims
- 0788US6569752B1Semiconductor element and fabricating method thereofTOSHIBA KK·Filed 2000·Granted May 27, 2003·56 cites·46 claims
- 0887US8012332B2Plating apparatus and methodEBARA CORP·Filed 2008·Granted Sep 6, 2011·4 cites·6 claims
- 0984US7601248B2Substrate holder and plating apparatusEBARA CORP·Filed 2003·Granted Oct 13, 2009·11 cites·25 claims
- 1083US9388505B2Electrochemical deposition methodEBARA CORP·Filed 2014·Granted Jul 12, 2016·1 cites·15 claims
- 1183US8936705B2Electrochemical deposition apparatusEBARA CORP·Filed 2012·Granted Jan 20, 2015·1 cites·14 claims
- 1280US9714476B2Semiconductor wafer holder and electroplating system for plating a semiconductor waferEBARA CORP·Filed 2015·Granted Jul 25, 2017·2 cites·8 claims
- 1380US9624596B2Electrochemical deposition methodEBARA CORP·Filed 2016·Granted Apr 18, 2017·3 cites·6 claims
- 1474US8961755B2Semiconductor wafer holder and electroplating system for plating a semiconductor waferYOSHIOKA JUNICHIRO·Filed 2011·Granted Feb 24, 2015·2 cites·7 claims
- 1571US9506162B2Electrochemical deposition methodEBARA CORP·Filed 2016·Granted Nov 29, 2016·0 cites·3 claims
- 1671US6716332B1Plating method and apparatusEBARA CORP·Filed 1999·Granted Apr 6, 2004·31 cites·19 claims
- 1769US9865493B2Substrate plating jigJCU CORP·Filed 2012·Granted Jan 9, 2018·2 cites·8 claims
- 1868US2009301395A1Plating apparatus and plating methodSEKIMOTO MASAHIKO·Filed 2009·Application pending·0 cites
- 1967US9593430B2Electrochemical deposition methodEBARA CORP·Filed 2016·Granted Mar 14, 2017·1 cites·3 claims
- 2064US6242624B1Method for making alkanol-or alkane-sulfone plumbateEBARA CORP·Filed 2000·Granted Jun 5, 2001·4 cites·5 claims
- 2162US7807027B2Substrate holder, plating apparatus, and plating methodEBARA CORP·Filed 2004·Granted Oct 5, 2010·6 cites·5 claims
- 2260US2013015075A1Plating apparatus and plating methodSEKIMOTO MASAHIKO·Filed 2012·Application pending·0 cites
- 2358US6269548B1Spin processing apparatusEBARA CORP·Filed 1998·Granted Aug 7, 2001·22 cites·19 claims
- 2455US2016138181A1Substrate plating deviceJCU CORP·Filed 2014·Application pending·0 cites
- 2551US8075756B2Semiconductor wafer holder and electroplating system for plating a semiconductor waferYOSHIOKA JUNICHIRO·Filed 2010·Granted Dec 13, 2011·0 cites·15 claims
- 2649US8133376B2Substrate holder, plating apparatus, and plating methodYOSHIOKA JUNICHIRO·Filed 2010·Granted Mar 13, 2012·0 cites·5 claims
- 2749US2006141157A1Plating apparatus and plating methodSEKIMOTO MASAHIKO·Filed 2004·Application pending·0 cites
- 2849US2015068890A1Substrate plating jig and plating device using sameYOSHIOKA JUNICHIRO·Filed 2012·Application pending·0 cites
- 2947US6365020B1Wafer plating jigEBARA CORP·Filed 1999·Granted Apr 2, 2002·14 cites·4 claims
- 3047US2014251798A1Substrate electroplating jigYOSHIOKA JUNICHIRO·Filed 2011·Application pending·0 cites
- 3146US2002027080A1Plating apparatus and methodFiled 2001·Application pending·0 cites
- 3245US7118664B2Plating method and apparatusEBARA CORP·Filed 2004·Granted Oct 10, 2006·1 cites·16 claims
- 3338US6500317B1Plating apparatus for detecting the conductivity between plating contacts on a substrateEBARA CORP·Filed 1998·Granted Dec 31, 2002·8 cites·5 claims
- 3437US2006081478A1Plating apparatus and plating methodSAHODA TSUYOSHI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →