Assignee
YOSHIOKA JUNICHIRO
JP·4 granted patents·2 pending applications·5 citations·filing 2010–2012
Top patents by PatentIndex Score
6 records- 0188US8337680B2Substrate holder and plating apparatusYOSHIOKA JUNICHIRO·Filed 2011·Granted Dec 25, 2012·3 cites·9 claims
- 0274US8961755B2Semiconductor wafer holder and electroplating system for plating a semiconductor waferYOSHIOKA JUNICHIRO·Filed 2011·Granted Feb 24, 2015·2 cites·7 claims
- 0351US8075756B2Semiconductor wafer holder and electroplating system for plating a semiconductor waferYOSHIOKA JUNICHIRO·Filed 2010·Granted Dec 13, 2011·0 cites·15 claims
- 0449US8133376B2Substrate holder, plating apparatus, and plating methodYOSHIOKA JUNICHIRO·Filed 2010·Granted Mar 13, 2012·0 cites·5 claims
- 0549US2015068890A1Substrate plating jig and plating device using sameYOSHIOKA JUNICHIRO·Filed 2012·Application pending·0 cites
- 0647US2014251798A1Substrate electroplating jigYOSHIOKA JUNICHIRO·Filed 2011·Application pending·0 cites
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