Substrate plating jig and plating device using same

Abstract

A plating jig and a plating device used for plating treatment of a substrate. The plating jig includes a mechanism rotatably driving a substrate holder, and detachably mounted on a plating bath integrally with a support portion. The plating jig includes the support portion which is formed in an engageable manner with a side wall of the plating bath, and the substrate holder which is vertically rotatably mounted on the support portion. The plating jig further includes a rotary mechanism for the substrate holder. The plating device utilizes the plating jig.

1 - 9 . (canceled) 
     
     
         10 . A plating jig comprising:
 a support portion detachably engaged with a side wall of a plating bath;   a substrate holder held on the support portion in a vertically rotatable manner;   a rotary means for the substrate holder which utilizes a flow of plating solution; and   a rotary means for the substrate holder which is rotated by a drive part;   or a combination of the rotary means for the substrate holder which utilizes the flow of the plating solution and the rotary means for the substrate holder which is rotated by the drive part.   
     
     
         11 . The plating jig according to  claim 10 , wherein the substrate holder comprises:
 a holding member including a substrate mounting surface;   an annular sealing member configured to sandwich the substrate between the sealing member and the holding member;   an outer frame member configured to be fitted on peripheries of the holding member and the sealing member; and   a shaft portion configured to be inserted into a hole portion formed in a center portion of the holding member.   
     
     
         12 . The plating jig according to  claim 11 , wherein the rotary means for the substrate holder includes a blade portion formed on an outer peripheral surface of the outer frame member of the substrate holder in a projecting manner. 
     
     
         13 . The plating jig according to  claim 11 , wherein the rotary means for the substrate holder includes a recessed portion formed on an outer peripheral surface of the outer frame member of the substrate holder. 
     
     
         14 . The plating jig according to  claim 11 , wherein the rotary means for the substrate holder is configured to transmit a rotational force to the shaft portion of the substrate holder by a rotary shaft of a drive part mounted on the support portion. 
     
     
         15 . The plating jig according to  claim 11 , wherein the rotary means for the substrate holder is configured to transmit a rotational force to the shaft portion of the substrate holder or the outer frame member by a gear member from a drive part mounted on the support portion. 
     
     
         16 . The plating jig according to  claim 10 , wherein the rotary means for the substrate holder is formed by combining a plurality of rotary means. 
     
     
         17 . A plating device, wherein the plating jig according to  claim 10  is engageable with a side wall of a plating bath, and a paddle which is movable in a reciprocating manner in a lateral direction is arranged between the substrate holder and an anode plate which is arranged to face the substrate holder in an opposed manner. 
     
     
         18 . A plating device, wherein the plating jig according to  claim 12  is engageable with a side wall of a plating bath, and a plating solution jetting port is formed in a bottom portion of the plating bath disposed below the substrate holder.