Substrate plating device

Abstract

A plating device includes a pl,ting bath containing therein a plating solution, a substrate holder for detachably holding a substrate, an anode disposed opposite to the substrate held by the substrate holder, a rail part stretched across an upper portion of the plating bath in parallel to the substrate holder, and a paddle suspended by the rail part and capable of reciprocating along the rail part. The paddle is vertically provided with a vane part rotatable round or pivotable on an axis part. The plating device can increase flow rate of a plating solution without installing a circulating pump outside a plating bath, and further can achieve same flow rate of the plating solution from a bottom of the plating bath to a level of the solution, enabling plating that forms a plating film having a uniform thickness on an entire region of a substrate and exhibits a high deposition rate.

1 - 5 . (canceled) 
     
     
         6 . A plating device comprising:
 a plating bath containing therein a plating solution;   a substrate holder configured to detachably hold a substrate;   an anode disposed opposite to the substrate held by the substrate holder;   a rail part stretched across above the plating bath in parallel to the substrate holder; and   a paddle suspended by the rail part and configured to reciprocate along the rail part;   wherein the paddle vertically includes a vane part rotatable around or pivotable on an axis part.   
     
     
         7 . The plating device according to  claim 6 , wherein the vane part is rotated by a driving means in a same direction at all times. 
     
     
         8 . The plating device according to  claim 6 , wherein the vane part is pivoted by a driving means in a predetermined angular range. 
     
     
         9 . The plating device according to  claim 6 , wherein the vane part includes a pair of vane parts vertically provided between upper and lower disc-form support parts in the paddle to be rotatable around the axis part connected to the upper support part as an axis of rotation. 
     
     
         10 . The plating device according to  claim 9 , wherein the paddle includes a cover curved into a half-round form along a side surface.