Ph sensor and manufacturing method
Abstract
Disclosed is a pH sensor comprising a carrier ( 10 ) comprising a plurality of conductive tracks and an exposed conductive area ( 40 ) defining a reference electrode connected to one of said conductive tracks; a sensing device ( 30 ) mounted on the carrier and connected at least one other of said conductive tracks; an encapsulation ( 20 ) covering the carrier, said encapsulation comprising a first cavity ( 22 ) exposing a surface ( 32 ) of the sensing device and a second cavity ( 24 ) exposing the exposed conductive area, said second cavity comprising a reference electrode material ( 42 ) and an ion reservoir material ( 44 ) sharing at least one ion type with said reference electrode material, the reference electrode material being sandwiched between the exposed conductive area and the ion reservoir material. A method of manufacturing such a pH sensor is also disclosed.
Claims
exact text as granted — not AI-modified1 . A pH sensor comprising:
a carrier ( 10 ) comprising a plurality of conductive tracks and an exposed conductive area ( 40 ) defining a reference electrode connected to one of said conductive tracks; a sensing device ( 30 ) mounted on the carrier and connected at least one other of said conductive tracks; an encapsulation ( 20 ) covering the carrier, said encapsulation comprising a first cavity ( 22 ) exposing a surface ( 32 ) of the sensing device and a second cavity ( 24 ) exposing the exposed conductive area, said second cavity comprising a reference electrode material ( 42 ) and an ion reservoir material ( 44 ) sharing at least one ion type with said reference electrode material, the reference electrode material being sandwiched between the exposed conductive area and the ion reservoir material.
2 . The pH sensor of claim 1 , further comprising a layer ( 46 , 48 ) impermeable to the ion type in the ion reservoir material ( 44 ) over the second cavity.
3 . The pH sensor of claim 1 , further comprising:
a first contact pad ( 16 ) connected to the sensing device ( 30 ) via one of said other of said conductive tracks ( 12 ); and a second contact pad connected to the exposed conductive area ( 40 ) via said one of said conductive tracks.
4 . The pH sensor of claim 1 , wherein the sensing device ( 30 ) comprises a transceiver, the pH sensor further comprising an antenna ( 50 ) on the carrier ( 10 ) connected to the at least one other of said conductive tracks ( 12 ).
5 . The pH sensor of claim 4 , wherein the exposed conductive area ( 40 ) is connected to the sensing device ( 30 ) via said one of said conductive tracks ( 12 ′).
6 . The pH sensor of claim 1 , wherein said encapsulation ( 20 ) further comprises a fluid channel ( 26 ) laterally extending from an edge of said encapsulation to the second cavity ( 24 ).
7 . The pH sensor of claim 6 , wherein said encapsulation ( 20 ) further comprises a further fluid channel ( 28 ) laterally extending from said edge to the first cavity ( 22 ).
8 . The pH sensor of claim 1 , wherein the carrier ( 10 ) is a printed circuit board.
9 . The pH sensor of claim 1 , wherein the sensing device ( 30 ) comprises an ion sensitive field effect transistor having its gate ( 32 ) exposed in the first cavity ( 22 ).
10 . The pH sensor of claim 1 , further comprising a sharp tip ( 21 ) for inserting the pH sensor into a substance.
11 . The pH sensor of claim 1 , wherein the exposed conductive area ( 40 ) comprises a gold-plated copper layer.
12 . The pH sensor of claim 1 , wherein the reference electrode material comprises Ag and AgCl and the ion reservoir material comprises chloride ions.
13 . The pH sensor of claim 12 , further comprising an ion-selective membrane ( 46 , 48 ) impermeable to the ion type in the ion reservoir material ( 44 ) over the second cavity.
14 . A method of manufacturing a pH sensor according to claim 1 , comprising:
providing a carrier having on its surface a plurality of conductive tracks, an exposed conductive area connected to one of said conductive tracks and a further exposed conductive area fixating an integrated circuit die to the further exposed conductive area, said integrated circuit die comprising an exposed pH-sensitive surface; encapsulating the resultant structure in a protective resin; forming first and second cavities in said protective resin, the first cavity exposing the pH-sensitive surface and the second cavity exposing the exposed conductive area; depositing a reference electrode material over the exposed conductive area; and depositing an ion reservoir material ( 44 ) sharing at least one ion type with said reference electrode material over said reference electrode material.
15 . The method of claim 14 , wherein said encapsulating step and said cavities forming step are performed simultaneously.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.