Inventor · disambiguated record
Coenraad Cornelis Tak
Also filed as: TAK COENRAAD · TAK COENRAAD CORNELIS
13 granted patents·4 pending applications·24 citations·filing 2006–2022
87Inventor score
Top patents by PatentIndex Score
17 records- 0182US8742470B2pH sensor and manufacturing methodMERZ MATTHIAS·Filed 2012·Granted Jun 3, 2014·5 cites·20 claims
- 0281US8853816B2Integrated circuits separated by through-wafer trench isolationNXP BV·Filed 2012·Granted Oct 7, 2014·5 cites·5 claims
- 0379US9070695B2Integrated circuit with sensor and method of manufacturing such an integrated circuitDAAMEN ROEL·Filed 2012·Granted Jun 30, 2015·6 cites·14 claims
- 0473US11366031B2Semiconductor device and method for forming a semiconductor deviceSCIOSENSE BV·Filed 2017·Granted Jun 21, 2022·1 cites·16 claims
- 0572US9666637B2Integrated sensor chip package with directional light sensor, apparatus including such a package and method of manufacturing such an integrated sensor chip packageNXP BV·Filed 2014·Granted May 30, 2017·2 cites·19 claims
- 0670US9177852B2Integrated circuits separated by through-wafer trench isolationNXP BV·Filed 2014·Granted Nov 3, 2015·2 cites·15 claims
- 0768US2022221363A1Pressure Sensor Device and Method for Forming a Pressure Sensor DeviceSCIOSENSE BV·Filed 2022·Application pending·0 cites
- 0866US10192842B2Package for environmental parameter sensors and method for manufacturing a package for environmental parameter sensorsAMS INT AG·Filed 2014·Granted Jan 29, 2019·2 cites·11 claims
- 0965US12180066B2Sensor package and method of producing the sensor packageSCIOSENSE BV·Filed 2021·Granted Dec 31, 2024·0 cites·16 claims
- 1063US9385099B2Die interconnectNXP BV·Filed 2014·Granted Jul 5, 2016·1 cites·14 claims
- 1162US11313749B2Pressure sensor device and method for forming a pressure sensor deviceSCIOSENSE BV·Filed 2017·Granted Apr 26, 2022·0 cites·9 claims
- 1253US2014262781A1Ph sensor and manufacturing methodNXP BV·Filed 2014·Application pending·0 cites
- 1351US11001495B2Sensor package and method of producing the sensor packageSCIOSENSE BV·Filed 2017·Granted May 11, 2021·0 cites·19 claims
- 1445US2022260446A1Sensor Arrangement and Method for Fabricating A Sensor ArrangementSCIOSENSE BV·Filed 2020·Application pending·0 cites
- 1542US2008290511A1Chip Assembly and Method of Manufacturing ThereofKONINKL PHILIPS ELECTRONICS NV·Filed 2006·Application pending·0 cites
- 1640US11664447B2Semiconductor device and a method of making a semiconductor deviceNexperia BV·Filed 2016·Granted May 30, 2023·0 cites·14 claims
- 1738US9461002B2Semiconductor deviceNXP BV·Filed 2015·Granted Oct 4, 2016·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →