Substrate processing apparatus

Abstract

A substrate processing apparatus includes a first processing chamber and a second processing chamber, a first substrate holding unit that holds a substrate in the first processing chamber, a chemical solution supply unit that supplies a chemical solution containing an etching component and a thickening agent to the substrate held by the first substrate holding unit, a substrate transfer unit that transfers the substrate from the first processing chamber to the second processing chamber in a state in which the chemical solution is held on the substrate, and a second substrate holding unit that holds a plurality of substrates on each of which the chemical solution is held in the second processing chamber.

What is claimed is: 
     
         1 . A substrate processing apparatus comprising:
 a first processing chamber and a second processing chamber;   a first substrate holding unit that holds a substrate in the first processing chamber;   a chemical solution supply unit that supplies a chemical solution containing an etching component and a thickening agent to the substrate held by the first substrate holding unit;   a substrate transfer unit that transfers the substrate from the first processing chamber to the second processing chamber in a state in which the chemical solution is held on the substrate; and   a second substrate holding unit that holds a plurality of substrates on each of which the chemical solution is held in the second processing chamber.   
     
     
         2 . The substrate processing apparatus according to  claim 1 , further comprising:
 a third processing chamber;   a third substrate holding unit that holds a substrate in the third processing chamber; and   a rinsing liquid supply unit that supplies a rinsing liquid to the substrate held by the third substrate holding unit,   wherein the substrate transfer unit transfers the substrate from the second processing chamber to the third processing chamber.   
     
     
         3 . The substrate processing apparatus according to  claim 1 , wherein the chemical solution supply unit partially supplies the chemical solution to a major surface of the substrate held by the first substrate holding unit. 
     
     
         4 . The substrate processing apparatus according to  claim 3 , further comprising a foreign-matter measuring unit that measures a position of foreign matters adhering to the major surface of the substrate,
 wherein the chemical solution supply unit supplies the chemical solution into a region in which the foreign matters are contained in the major surface.   
     
     
         5 . The substrate processing apparatus according to  claim 4 , further comprising a measuring chamber in which the position of the foreign matters adhering to the substrate is measured by the foreign-matter measuring unit,
 wherein the substrate transfer unit transfers the substrate from the measuring chamber to the first processing chamber.   
     
     
         6 . The substrate processing apparatus according to  claim 3 , wherein the chemical solution supply unit supplies the chemical solution into a predetermined region of the major surface.