Formulations for the removal of particles generated by cerium-containing solutions

Abstract

Compositions and methods for removing lanthanoid-containing solids and/or species from the surface of a microelectronic device or microelectronic device fabrication hardware. Preferably, the lanthanoid-containing solids and/or species comprise cerium. The composition is preferably substantially devoid of fluoride ions.

1 . A method of removing lanthanoid-containing solids and/or species from the surface of a microelectronic device or microfabrication hardware, said method comprising contacting the surface with a composition that substantially dissolves the lanthanoid-containing solids and/or species present on the surface. 
     
     
         2 . The method of  claim 1 , wherein the lanthanoid-containing solids are particulate matter present on the surface. 
     
     
         3 . The method of  claim 2 , wherein the selectivity of the composition for the lanthanoid-containing solids and/or species relative to the surface is at least about 100:1. 
     
     
         4 . The method of  claim 1 , wherein the lanthanoid-containing species are ionic or molecular in nature and are adsorbed onto the surface of the microelectronic device or microfabrication hardware. 
     
     
         5 . The method of  claim 1 , wherein the lanthanoid-containing solids and/or species comprises at least one species selected from the group consisting of lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, and lutetium. 
     
     
         6 . The method of  claim 1  The method of any of the preceding claims, wherein the lanthanoid-containing solids and/or species comprises cerium. 
     
     
         7 . The method of  claim 6 , wherein the lanthanoid-containing solids and/or species comprise Ce(IV). 
     
     
         8 . The method of  claim 1 , wherein temperature is in a range from about room temperature to about 100° C. for time in a range from about 10 sec to about 60 minutes. 
     
     
         9 . (canceled) 
     
     
         10 . (canceled) 
     
     
         11 . The method of  claim 1 , said method further comprising, prior to contacting the surface with the composition that substantially dissolves the lanthanoid-containing solids and/or species, contacting the surface of the microelectronic device with a resist removal composition comprising at least one salt or coordination complex of a lanthanoid element to remove resist from said surface. 
     
     
         12 . The method of  claim 11 , wherein the resist removal composition comprises cerium. 
     
     
         13 . The method of  claim 11 , wherein the resist removal composition comprises cerium ammonium nitrate. 
     
     
         14 . The method of  claim 1 , wherein the composition comprises at least one acid, at least one reducing agent, and water, wherein the composition is substantially devoid of fluoride ions. 
     
     
         15 . The method of  claim 1 , wherein the pH of the composition is in a range from about 0 to about 4. 
     
     
         16 . The method of  claim 14 , wherein the at least one reducing agent comprises hydrogen peroxide, ascorbic acid, borane-pyridine, borane-morpholine, hydroxylamine sulfate, hydroxylamine hydrochloride, ammonium nitrite, ammonium sulfite, ammonium hydrogen sulfite, hydrazine sulfate, hydrazine hydrochloride, ammonium hydrogen sulfide, diethyl malonate, hydroquinone, ammonium metabisulfite, polyphenon 60, glucose, ammonium citrate, hydrogen, formic acid, oxalic acid, acetaldehyde, hydrogen iodide, ammonium phosphite, ammonium hydrogen phosphite, hypophosphorous acid, and combinations thereof. 
     
     
         17 . The method of  claim 14 , wherein the at least one reducing agent comprises ascorbic acid. 
     
     
         18 . The method of  claim 14 , wherein the at least one acid comprises at least one strong acid or at least one weak acid. 
     
     
         19 . The method of  claim 18 , wherein the at least one strong acid comprises a species selected from the group consisting of nitric acid, sulfuric acid, perchloric acid, hydrochloric acid, hydrobromic acid, hydroiodic acid, methanesulfonic acid, and combinations thereof. 
     
     
         20 . The method of  claim 18 , wherein the at least one strong acid comprises sulfuric acid. 
     
     
         21 . The method of  claim 18 , wherein the composition further comprises the salt of the at least one strong acid. 
     
     
         22 . (canceled) 
     
     
         23 . The method of  claim 18 , wherein the at least one weak acid comprises a species selected from the group consisting of nitrous acid, phosphorous acid, hydrogen bisulfate, hydrogen selenite, phosphoric acid, cyanic acid, formic acid, glyceric acid, glycolic acid, glyoxylic acid, lactic acid, pyruvic acid, mandelic acid, succinic acid, malonic acid, and combinations thereof.