Inventor · disambiguated record
Jeffrey A. Barnes
Also filed as: BARNES JEFFREY · BARNES JEFFREY A
16 granted patents·14 pending applications·175 citations·filing 2003–2018
93Inventor score
Files withADVANCED TECH MATERIALS12ENTEGRIS INC6BARNES JEFFREY A5ADVANCED TEHNOLOGY MATERIALS I1ANGST DAVID1
Top patents by PatentIndex Score
30 records- 0194US9063431B2Aqueous cleaner for the removal of post-etch residuesBARNES JEFFREY A·Filed 2011·Granted Jun 23, 2015·20 cites·20 claims
- 0293US9074170B2Copper cleaning and protection formulationsBARNES JEFFREY A·Filed 2009·Granted Jul 7, 2015·26 cites·22 claims
- 0393US8754021B2Non-amine post-CMP composition and method of useBARNES JEFFREY A·Filed 2010·Granted Jun 17, 2014·16 cites·19 claims
- 0492US7365045B2Aqueous cleaner with low metal etch rate comprising alkanolamine and tetraalkylammonium hydroxideADVANCED TEHNOLOGY MATERIALS I·Filed 2005·Granted Apr 29, 2008·32 cites·14 claims
- 0590US9831088B2Composition and process for selectively etching metal nitridesCHEN TIANNIU·Filed 2011·Granted Nov 28, 2017·15 cites·12 claims
- 0690US9546321B2Compositions and methods for selectively etching titanium nitrideBARNES JEFFREY A·Filed 2012·Granted Jan 17, 2017·11 cites·20 claims
- 0790US8685909B2Antioxidants for post-CMP cleaning formulationsANGST DAVID·Filed 2009·Granted Apr 1, 2014·22 cites·19 claims
- 0888US10176979B2Post-CMP removal using compositions and method of useENTEGRIS INC·Filed 2013·Granted Jan 8, 2019·10 cites·21 claims
- 0986US10392560B2Compositions and methods for selectively etching titanium nitrideENTEGRIS INC·Filed 2017·Granted Aug 27, 2019·4 cites·17 claims
- 1084US9528078B2Antioxidants for post-CMP cleaning formulationsADVANCED TECH MATERIALS·Filed 2014·Granted Dec 27, 2016·4 cites·20 claims
- 1184US7922823B2Compositions for processing of semiconductor substratesADVANCED TECH MATERIALS·Filed 2006·Granted Apr 12, 2011·12 cites·10 claims
- 1283USRE46427EAntioxidants for post-CMP cleaning formulationsADVANCED TECH MATERIALS·Filed 2015·Granted Jun 6, 2017·2 cites·19 claims
- 1370US10557107B2Post chemical mechanical polishing formulations and method of useENTEGRIS INC·Filed 2018·Granted Feb 11, 2020·1 cites·8 claims
- 1464US2017096624A1New antioxidants for post-cmp cleaning formulationsADVANCED TECH MATERIALS·Filed 2016·Application pending·0 cites
- 1559US9340760B2Non-amine post-CMP composition and method of useADVANCED TECH MATERIALS·Filed 2014·Granted May 17, 2016·0 cites·17 claims
- 1653US2016322232A1Use of non-oxidizing strong acids for the removal of ion-implanted resistENTEGRIS INC·Filed 2014·Application pending·0 cites
- 1751US10347504B2Use of non-oxidizing strong acids for the removal of ion-implanted resistENTEGRIS INC·Filed 2018·Granted Jul 9, 2019·0 cites·10 claims
- 1851US2016237385A1Non-amine post-cmp composition and method of useADVANCED TECH MATERIALS·Filed 2016·Application pending·0 cites
- 1951US2008200361A1Aqueous cleaner with low metal etch rateWALKER ELIZABETH L·Filed 2008·Application pending·0 cites
- 2047US2014318584A1Formulations for the removal of particles generated by cerium-containing solutionsCOOPER EMANUEL I·Filed 2012·Application pending·0 cites
- 2146US2006148666A1Aqueous cleaner with low metal etch rateADVANCED TECH MATERIALS·Filed 2004·Application pending·0 cites
- 2246US2015307818A1Aqueous cleaner for the removal of post-etch residuesADVANCED TECH MATERIALS·Filed 2015·Application pending·0 cites
- 2345US2016032221A1Copper cleaning and protection formulationsADVANCED TECH MATERIALS·Filed 2015·Application pending·0 cites
- 2444US2005145311A1Method for monitoring surface treatment of copper containing devicesFiled 2003·Application pending·0 cites
- 2544US2010286014A1Low ph post-cmp residue removal composition and method of useADVANCED TECH MATERIALS·Filed 2007·Application pending·0 cites
- 2643US10340150B2Ni:NiGe:Ge selective etch formulations and method of using sameENTEGRIS INC·Filed 2014·Granted Jul 2, 2019·0 cites·12 claims
- 2741US2016340620A1Post chemical mechanical polishing formulations and method of useADVANCED TECH MATERIALS·Filed 2015·Application pending·0 cites
- 2841US2015162213A1Formulations for wet etching nipt during silicide fabricationADVANCED TECH MATERIALS·Filed 2013·Application pending·0 cites
- 2941US2016075971A1Copper cleaning and protection formulationsLIU JUN·Filed 2014·Application pending·0 cites
- 3039US2008076688A1Copper passivating post-chemical mechanical polishing cleaning composition and method of useBARNES JEFFREY A·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →