Method and apparatus for multi-planar edge-extended wafer translator

Abstract

An apparatus, suitable for coupling a pads of integrated circuits on wafer to the pogo pins of a pogo tower in a test system without the need of a probe card, includes a body having a first surface and a second surface, the body having a substantially circular central portion, and a plurality of bendable arms extending outwardly from the central portion, each bendable arm having a connector tab disposed at the distal end thereof; a first plurality of contact terminals disposed on the second surface of the central portion of the body, the first plurality of contact terminals arranged in pattern to match the layout of pads on a wafer to be contacted; at least one contact terminal disposed on the first surface of the plurality of connector tabs; and a plurality of electrically conductive pathways disposed in the body such that each of the first plurality of contact terminals is electrically connected to a corresponding one of the contact terminals on the first surface of the connector tabs.

1 . An apparatus, comprising:
 a body having a first surface and a second surface, the body having a substantially circular central portion, and a plurality of bendable arms extending radially outwardly from the central portion, each bendable arm having a connector tab disposed at the distal end thereof;   a first plurality of contact terminals disposed on the second surface of the central portion of the body, the first plurality of contact terminals arranged in a pattern to match the layout of a first plurality of pads across a wafer to be contacted, and operable to simultaneously provide electrical connection to each of the first plurality of pads;   at least one contact terminal disposed on the first surface of the plurality of connector tabs; and   a plurality of electrically conductive pathways disposed in the body such that each of the first plurality of contact terminals is electrically connected to a corresponding one of the contact terminals on the first surface of the connector tabs;   wherein the substantially circular central portion of the body is removably attachable to the wafer; wherein the substantially circular central portion of the body has an area that substantially matches the area of the wafer; and   wherein the plurality of bendable arms extending radially outwardly from the central portion provide electrical pathways that extend beyond the circumferential edge of the wafer.   
     
     
         2 - 10 . (canceled)