Cooling device

Abstract

[Problem] When a size of a cooling device using a boiling cooling system is reduced, a cooling performance decreases. [Means for solving the problems] It is characterized in that an evaporation unit which stores refrigerant, a condensing unit which condenses a gas-phase refrigerant produced by vaporizing the refrigerant in the evaporation unit to a liquid and dissipates heat, a vapor pipe which conveys the gas-phase refrigerant to the condensing unit, and a liquid pipe which conveys a liquid-phase refrigerant obtained by condensing the gas-phase refrigerant in the condensing unit to the evaporation unit are included, the condensing unit includes a heat dissipation flow path, an upper header which connects the vapor pipe and the heat dissipation flow path, and a lower header which connects the heat dissipation flow path and the liquid pipe, the upper header includes a flow path header portion connected to the heat dissipation flow path and an upper header extension portion located around the flow path header portion, and the upper header extension portion has a connection port connected to the vapor pipe in a face to which the heat dissipation flow path is connected.

1 . A cooling device comprising:
 an evaporation unit which stores refrigerant;   a condensing unit which condenses a gas-phase refrigerant produced by vaporizing the refrigerant in the evaporation unit to a liquid and dissipates heat;   a vapor pipe which conveys the gas-phase refrigerant to the condensing unit; and   a liquid pipe which conveys a liquid-phase refrigerant obtained by condensing the gas-phase refrigerant in the condensing unit to the evaporation unit, wherein   the condensing unit includes a heat dissipation flow path, an upper header which connects the vapor pipe and the heat dissipation flow path, and a lower header which connects the heat dissipation flow path and the liquid pipe,   the upper header includes a flow path header portion connected to the heat dissipation flow path and an upper header extension portion located around the flow path header portion, and   the upper header extension portion has a connection port connected to the vapor pipe in a face to which the heat dissipation flow path is connected.   
     
     
         2 . The cooling device described in  claim 1 , wherein a width of the upper header extension portion in a direction from the connection port toward the flow path header and a width thereof in a vertical direction are approximately equal to a width of the flow path header portion in a direction from the connection port toward the flow path header and a width thereof in a vertical direction, respectively. 
     
     
         3 . The cooling device described in  claim 1 , wherein a width of the upper header extension portion in a direction from the connection port toward the flow path header and a width thereof in the vertical direction are smaller than a width of the flow path header portion in a direction from the connection port toward the flow path header and a width thereof in the vertical direction, respectively. 
     
     
         4 . The cooling device described in  claim 1 , wherein a cross-sectional area of the upper header extension portion in the direction from the connection port toward the flow path header and a cross-sectional area thereof in the vertical direction are greater than the cross-sectional area of the vapor pipe. 
     
     
         5 . The cooling device described in  claim 1 , wherein a length of the upper header extension portion in the direction from the connection port toward the flow path header is smaller than the length of the vapor pipe in the vertical direction. 
     
     
         6 . The cooling device described in  claim 1 , wherein the cooling device includes a plurality of the vapor pipes and the evaporation unit is connected to the upper header by a plurality of the vapor pipes. 
     
     
         7 . The cooling device described in  claim 1 , wherein
 the condensing unit is composed of a plurality of the heat dissipation flow paths and   the vapor pipe is disposed in a direction perpendicular to a direction in which a plurality of the heat dissipation flow paths are disposed in parallel.   
     
     
         8 . The cooling device described in  claim 1 , wherein
 the condensing unit is composed of a plurality of the heat dissipation flow paths and   the vapor pipe is disposed in line approximately parallel to the direction in which a plurality of the heat dissipation flow paths are disposed in parallel.   
     
     
         9 . The cooling device described in  claim 1 , wherein the vapor pipe is extended in a straight line shape in a vertical direction. 
     
     
         10 . The cooling device described in  claim 1 , wherein
 the vapor pipe connects an upper part of the evaporation unit and a lower surface part of the upper header and   the liquid pipe connects a side surface part of the evaporation unit and the lower header.   
     
     
         11 . The cooling device described in  claim 1 , wherein
 the cooling device includes a plurality of the heat dissipation flow paths,   a heat dissipation fin is disposed in between a plurality of the adjacent heat dissipation flow paths, and   the heat dissipation fin is thermally connected to the heat dissipation flow path.   
     
     
         12 . The cooling device described in  claim 1 , wherein one of the vapor pipe and the liquid pipe has a structure in which an inner layer is a metal layer and an outer layer is a resin layer.