Cooling system

Abstract

An object in one aspect is to supply, to an electronic device, cooling fluid of a temperature lower than a temperature of an environment in which the electronic device is set. A cooling system has an electronic device, a supply pipe, a discharge pipe, and a heat exchange portion. The supply pipe supplies cooling fluid to the electronic device, and the discharge pipe discharges cooling fluid from the electronic device. The heat exchange portion exchanges heat between the supply pipe and the discharge pipe in a case in which a temperature of cooling fluid flowing through the supply pipe is lower than a dew point of an environment in which the electronic device is set.

What is claimed is: 
     
         1 . A cooling system comprising:
 an electronic device;   a supply pipe that supplies a cooling fluid to the electronic device;   a discharge pipe that discharges the cooling fluid from the electronic device; and   a heat exchange portion that exchanges heat between the supply pipe and the discharge pipe in a case in which a temperature of the cooling fluid that flows through the supply pipe is lower than a dew point of an environment in which the electronic device is set.   
     
     
         2 . The cooling system of  claim 1 , wherein the heat exchange portion has
 a first porous body that is provided at the supply pipe, and   a second porous body that connects the discharge pipe and the first porous body.   
     
     
         3 . The cooling system of  claim 2 , wherein
 the first porous body is subjected to a water-repelling treatment, and   the second porous body is subjected to a hydrophilic treatment,   
     
     
         4 . The cooling system of  claim 3 , wherein a Freon-based or a silicone-based processing agent is us d in the water-repelling treatment. 
     
     
         5 . The cooling system of  claim 3 , wherein an acrylamide-based processing agent is used in the hydrophilic treatment. 
     
     
         6 . The cooling system of  claim 2 , wherein a pore diameter of the first porous body is set to be larger than a pore diameter of the second porous body. 
     
     
         7 . The cooling system of  claim 2 , wherein atmosphere of the environment is supplied to the first porous body and the second porous body. 
     
     
         8 . The cooling system of  claim 7 , wherein
 the first porous body and the second porous body are accommodated within a housing of the electronic device, and   the atmosphere of the environment is supplied to the first porous body and the second porous body by a flow of cooling wind being formed within the housing by a blowing portion.   
     
     
         9 . The cooling system of  claim 2 , wherein the first porous body is provided at a periphery of the supply pipe. 
     
     
         10 . The cooling system of  claim 2 , wherein the first porous body and the second porous body are formed of polyimide-based or fluorine-based resins. 
     
     
         11 . The cooling system of  claim 1 , wherein the heat exchange portion has
 a water-repellant member that is provided at the supply pipe, and   a hydrophilic member that connects the discharge pipe and the water-repellant member.   
     
     
         12 . The cooling system of  claim 1 , wherein
 the supply pipe and the discharge pipe have parallel portions that are provided parallel to one another, and   the heat exchange portion is provided at the parallel portions.   
     
     
         13 . The cooling system of  claim 1 , wherein
 the electronic device has a substrate to which a heat-generating body is mounted, and a cooling section that exchanges heat with the heat-generating body, and   the supply pipe supplies the cooling fluid to the cooling section.   
     
     
         14 . The cooling system of  claim 1 , further comprising:
 a blowing portion that forms a flow of cooling wind within a housing of the electronic device; and   a radiator that is provided at the supply pipe and that is disposed further toward a downstream side, of the flow of the cooling wind, than a substrate that is accommodated within the housing and to which a heat-generating body is mounted.   
     
     
         15 . The cooling system of  claim 14 , wherein
 a bent portion, that is bent in a substantial U-shape as seen in plan view, is formed at a region of the supply pipe which region is further toward an upstream side than a region of heat exchange by the heat exchange portion, and   the radiator is provided at the bent portion.   
     
     
         16 . The cooling system of  claim 1 , further comprising:
 a bypass pipe that connects a region that is further toward an upstream side than a region of beat exchange by the heat exchange portion at the supply pipe, and a region that is further toward a downstream side than a region of heat exchange by the heat exchange portion at the discharge pipe; and   a flow quantity adjusting portion that adjusts a proportion of a quantity of flow of the cooling fluid that flows through the supply pipe and a quantity of flow of the cooling fluid that flows through the bypass pipe.   
     
     
         17 . The cooling system of  claim 16 , further comprising:
 a temperature detector that detects a temperature of the cooling fluid supplied to the electronic device;   a humidity detector that detects a humidity of the environment; and   a control section that controls the flow quantity adjusting portion on the basis of results of detection of the temperature detector and the humidity detector, such that the temperature of the cooling fluid supplied to the electronic device becomes higher than a dew point of the environment.   
     
     
         18 . The cooling system of  claim 17 , wherein the control section controls the flow quantity adjusting portion on the basis of the results of detection of the temperature detector and the humidity detector, such that the temperature of the cooling fluid supplied to the electronic device is kept within a given temperature range that is higher than the dew point of the environment.