Manufacturing advanced test probes

Abstract

Embodiments relate to the formation of test probes. One method includes providing a bulk sheet of an electrically conductive material. A laser is used to cut through the bulk sheet in a predetermined pattern to form a test probe. Other embodiments are described and claimed.

What is claimed: 
     
         1 . A method, comprising:
 providing a bulk sheet of an electrically conductive material; and   using a laser to cut through the bulk sheet in a predetermined pattern to form a test probe.   
     
     
         2 . The method of  claim 1 , wherein the bulk sheet of an electrically conductive material comprises tungsten. 
     
     
         3 . The method of  claim 1 , wherein the bulk sheet of an electrically conductive material comprises a material selected from the group consisting of NiW, NiMn, CrMo, and BeCu. 
     
     
         4 . The method of  claim 1 , wherein the using the laser to cut through the bulk sheet includes forming the test probe to include a plurality of flat sidewalls. 
     
     
         5 . The method of  claim 1 , wherein the using the laser to cut through the bulk sheet includes forming the test probe to include a curved section. 
     
     
         6 . The method of  claim 1 , further comprising positioning the test probe in a test probe card. 
     
     
         7 . The method of  claim 1 , wherein the using a laser to cut through the bulk sheet includes multiple passes of the laser over the same portion of the bulk sheet. 
     
     
         8 . The method of  claim 1 , further comprising forming a sacrificial layer on the bulk sheet, the sacrificial layer positioned to minimize the size heat affected zone. 
     
     
         9 . The method of  claim 1 , further comprising performing a deburring operation after the forming the test probe, the deburring operation adapted to smooth shape edges on the test probe. 
     
     
         10 . A method comprising:
 providing a test probe card comprising a structure adapted to hold a plurality of test probes therein; and   positioning a plurality of laser cut test probes within the probe test card.   
     
     
         11 . The method of  claim 10 , wherein the test probes are formed from a material comprising tungsten. 
     
     
         12 . The method of  claim 10 , wherein the test probes are formed from a material selected from the group consisting of NiW, NiMn, CrMo, and BeCu. 
     
     
         13 . The method of  claim 10 , wherein the test probes include a plurality of flat sidewalls. 
     
     
         14 . The method of  claim 10 , wherein the test probes include a curved section. 
     
     
         15 . A test probe comprising:
 a test probe formed from an electrically conductive material, the test probe including a plurality of laser cut surfaces;   the test probe including a heat affected zone extending a distance inward from the laser cut surfaces, the heat affected zone comprising a region that was heated to a temperature of at least the melting point of the electrically conductive material, the heat effected zone having a microstructure that is different than the microstructure outside of the heat affected zone.   
     
     
         16 . The test probe of  claim 15 , wherein the electrically conductive material comprises tungsten. 
     
     
         17 . The test probe of  claim 15 , wherein the electrically conductive material comprises a material selected from the group consisting of NiW, NiMn, CrMo, and BeCu. 
     
     
         18 . The test probe of  claim 15 , wherein the test probe includes a plurality of flat sidewalls. 
     
     
         19 . The test probe of  claim 15 , wherein the test probe includes a curved section. 
     
     
         20 . A test probe card comprising:
 a structure adapted to hold a plurality of test probes therein;   a plurality of test probes positioned in the structure, the test probes formed from an electrically conductive material, the test probes including a plurality of laser cut surfaces;   the test probes including a heat affected zone extending a distance inward from the laser cut surfaces, the heat affected zone comprising a region that was heated to a temperature of at least the melting point of the electrically conductive material, the heat effected zone having a microstructure that is different than the microstructure outside of the heat affected zone.   
     
     
         21 . The test probe card of  claim 20 , wherein the electrically conductive material comprises tungsten. 
     
     
         22 . The test probe card of  claim 20 , wherein the electrically conductive material comprises a material selected from the group consisting of NiW, NiMn, CrMo, and BeCu. 
     
     
         23 . The test probe card of  claim 20 , wherein the test probes each include a plurality of flat sidewalls. 
     
     
         24 . The test probe card of  claim 20 , wherein the test probes each include a curved section.