Package assembly for thin wafer shipping

Abstract

A package assembly for thin wafer shipping using force distribution plates and a method of use are disclosed. The package assembly includes a container and upper and lower force distribution plates provided within the container. The upper and lower force distribution plates are positioned respectively on a top side and bottom side of the container.

What is claimed is: 
     
         1 . A package assembly, comprising:
 a container; and   upper and lower force distribution plates provided within the container positioned respectively on a top side and bottom side thereof.   
     
     
         2 . The package assembly of  claim 1 , wherein the upper and lower force distribution plates are positioned on a top side and bottom side of a stack of wafers within the container. 
     
     
         3 . The package assembly of  claim 2 , wherein the upper and lower force distribution plates are two force distribution plates. 
     
     
         4 . The package assembly of  claim 2 , wherein the upper and lower force distribution plates are structured to distribute forces over an entire surface of wafers of the stack of wafers. 
     
     
         5 . The package assembly of  claim 4 , wherein the upper and lower force distribution plates are structured to distribute vibration forces occurring during shipping and vertical forces applied during packaging and unpackaging. 
     
     
         6 . The package assembly of  claim 2 , wherein the upper and lower force distribution plates are structured to contain the stack of wafers as a unit, allowing them to move only as a unit and distribute all forces across a wafer surface. 
     
     
         7 . The package assembly of  claim 2 , wherein the upper and lower force distribution plates are silicon wafers. 
     
     
         8 . The package assembly of  claim 2 , wherein the upper and lower force distribution plates have a thickness of about 1 mm to about 2 mm. 
     
     
         9 . The package assembly of  claim 2 , wherein the upper and lower force distribution plates are structured to distribute a load across a surface of the stack of wafers of 1 N or more. 
     
     
         10 . The package assembly of  claim 2 , further comprising electrostatic discharge (ESD) compliant material sheets interposed between each wafer of the stack of wafers. 
     
     
         11 . The package assembly of  claim 10 , further comprising upper and lower foam cushions or sheets positioned on a surface of each of the upper and lower force distribution plates, on opposing sides contacting the stack of wafers. 
     
     
         12 . The package assembly of  claim 11 , further comprising one or more foam cushions or sheets positioned about a periphery of the stack of wafers. 
     
     
         13 . The package assembly of  claim 12 , further comprising a cover on the upper foam cushion or sheet. 
     
     
         14 . A package assembly, comprising:
 a container;   a stack of wafers interposed with ESD compliant material sheets positioned within the container; and   a distribution plate positioned on a top side and bottom side of the stack of wafers within the container, wherein the distribution plates are structured to:
 contain the stack of wafers as a unit, allowing them to move only as a unit; and 
 distribute forces across a surface of the stack of wafers. 
   
     
     
         15 . The package assembly of  claim 14 , wherein the distribution plates are structured to distribute vibration forces occurring during shipping and vertical forces applied during packaging and unpackaging. 
     
     
         16 . The package assembly of  claim 14 , wherein the distribution plates are silicon wafers. 
     
     
         17 . The package assembly of  claim 14 , wherein the distribution plates are structured to distribute a load across a surface of the stack of wafers of 1 N or more. 
     
     
         18 . The package assembly of  claim 14 , further comprising:
 upper and lower foam cushions or sheets positioned on a surface of each of the distribution plates, on opposing sides contacting the stack of wafers;   one or more foam cushions or sheets positioned about a periphery of the stack of wafers; and   a cover on the upper foam cushion or sheet.   
     
     
         19 . The package assembly of  claim 14 , wherein the distribution plates have a thickness of about 1 mm to about 2 mm. 
     
     
         20 . A method, comprising:
 placing a lower foam cushion or sheet in a bottom of a container;   placing a lower distribution plate in the container, above the lower foam cushion or sheet;   stacking a plurality of wafers and sheets interposed therebetween on the lower distribution plate;   placing an upper distribution plate in the container, on top of the stack of wafers;   placing an upper foam cushion or sheet on the upper distribution plate; and   sealing the container.