Inventor · disambiguated record
Damyon L. Corbin
Also filed as: CORBIN DAMYON L
7 granted patents·1 pending application·15 citations·filing 2013–2019
80Inventor score
Top patents by PatentIndex Score
8 records- 0190US10090180B2Package assembly for thin wafer shipping and method of useIBM·Filed 2016·Granted Oct 2, 2018·5 cites·12 claims
- 0288US9543175B2Package assembly for thin wafer shipping and method of useIBM·Filed 2013·Granted Jan 10, 2017·6 cites·18 claims
- 0387US10468280B2Package assembly for thin wafer shipping and method of useIBM·Filed 2018·Granted Nov 5, 2019·3 cites·18 claims
- 0466US10784137B2Package assembly for thin wafer shipping and method of useIBM·Filed 2019·Granted Sep 22, 2020·0 cites·18 claims
- 0562US8912091B2Backside metal ground plane with improved metal adhesion and design structuresIBM·Filed 2013·Granted Dec 16, 2014·1 cites·23 claims
- 0658US10622235B2Package assembly for thin wafer shipping and method of useIBM·Filed 2016·Granted Apr 14, 2020·0 cites·14 claims
- 0744US10192748B2Controlling of etch depth in deep via etching processes and resultant structuresGLOBALFOUNDRIES INC·Filed 2016·Granted Jan 29, 2019·0 cites·19 claims
- 0841US2015076029A1Package assembly for thin wafer shippingIBM·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →