Method of processing a substrate

Abstract

A method of processing a substrate or panel is disclosed. A substrate having thereon an array of chips is provided. A mask layer is laminated on the substrate. The mask layer has a plurality of openings to reveal active areas of the chips respectively. A spray-coating process is then performed to form an adhesive film in the active areas. The mask layer is then stripped off.

What is claimed is: 
     
         1 . A method of processing a substrate, comprising:
 providing a substrate having thereon a plurality of chips;   laminating a mask layer on the substrate, wherein the mask layer has a plurality of openings to reveal active areas of the chips respectively;   performing a spray-coating process to form an adhesive film in the active areas; and   stripping the mask layer off.   
     
     
         2 . The method of processing a substrate according to  claim 1 , wherein the spray-coating process employs an adhesive material having a low viscosity that ranges between 10 centipoise (cps) and 3000 cps. 
     
     
         3 . The method of processing a substrate according to  claim 2 , wherein the adhesive material having a low viscosity comprises epoxy resins, polyesters, or polymethyl methacrylate (PMMA). 
     
     
         4 . The method of processing a substrate according to  claim 1 , wherein the adhesive film has a solvent residue rate that is greater than 1%. 
     
     
         5 . The method of processing a substrate according to  claim 1 , wherein the adhesive film has a thickness that is smaller than 5 micrometers. 
     
     
         6 . The method of processing a substrate according to  claim 1 , wherein the adhesive film has a uniformity that is smaller than 10%. 
     
     
         7 . The method of processing a substrate according to  claim 1 , wherein the adhesive film has a surface roughness Ra that is greater than 0.01 micrometers. 
     
     
         8 . The method of processing a substrate according to  claim 1 , wherein the adhesive film has a surface profile variation of about 0.3 μm/mm. 
     
     
         9 . The method of processing a substrate according to  claim 1 , wherein the mask layer is a releasable adhesive. 
     
     
         10 . The method of processing a substrate according to  claim 1 , wherein the mask layer is a metal mask. 
     
     
         11 . The method of processing a substrate according to  claim 1 , wherein the substrate comprises a transparent substrate and at least one sensor electrode layer. 
     
     
         12 . The method of processing a substrate according to  claim 1 , wherein the plurality of chips are arranged in an array and are separated from one another by a cutting lane.