Substrate processing device and substrate processing method

Abstract

A substrate processing device 10 has a water removing unit 110 and, when a solvent supply unit 58 supplies a volatile solvent to a surface of a substrate W, the water removing unit 110 supplies a water removing agent to the surface of the substrate W to promote replacement of the cleaning water on the surface of the substrate W with the volatile solvent.

What is claimed is: 
     
         1 . A substrate processing device comprising:
 a cleaning water supply unit supplying a cleaning water to a surface of a substrate; and   a solvent supply unit supplying a volatile solvent to the surface of the substrate supplied with the cleaning water, and replacing the cleaning water on the surface of the substrate with the volatile solvent, wherein   the substrate processing device further comprises a water removing unit, and   when the solvent supply unit supplies the volatile solvent to the surface of the substrate, the water removing unit supplies a water removing agent to the surface of the substrate, and promotes the replacement of the cleaning water on the surface of the substrate with the volatile solvent.   
     
     
         2 . The substrate processing device according to  claim 1 , wherein
 the water removing agent is made of a hydrolyzable substance.   
     
     
         3 . The substrate processing device according to  claim 1 , further comprising:
 a heating and drying unit heating the surface of the substrate supplied with the volatile solvent to dry the surface of the substrate by removing a droplet of the volatile solvent produced on the surface of the substrate by a heating operation.   
     
     
         4 . The substrate processing device according to  claim 2 , further comprising:
 a heating and drying unit heating the surface of the substrate supplied with the volatile solvent to dry the surface of the substrate by removing a droplet of the volatile solvent produced on the surface of the substrate by a heating operation.   
     
     
         5 . The substrate processing device according to  claim 1 , wherein
 the water removing unit adds the water removing agent to the volatile solvent in a solvent supply tank.   
     
     
         6 . The substrate processing device according to  claim 2 , wherein
 the water removing unit adds the water removing agent to the volatile solvent in a solvent supply tank.   
     
     
         7 . The substrate processing device according to  claim 3 , wherein
 the water removing unit adds the water removing agent to the volatile solvent in a solvent supply tank.   
     
     
         8 . The substrate processing device according to  claim 4 , wherein
 the water removing unit adds the water removing agent to the volatile solvent in a solvent supply tank.   
     
     
         9 . The substrate processing device according to  claim 1 , wherein
 the water removing unit adds the water removing agent to the volatile solvent in a solvent supply passage forcedly feeding the volatile solvent in a solvent supply tank.   
     
     
         10 . The substrate processing device according to  claim 2 , wherein
 the water removing unit adds the water removing agent to the volatile solvent in a solvent supply passage forcedly feeding the volatile solvent in a solvent supply tank.   
     
     
         11 . The substrate processing device according to  claim 3 , wherein
 the water removing unit adds the water removing agent to the volatile solvent in a solvent supply passage forcedly feeding the volatile solvent in a solvent supply tank.   
     
     
         12 . The substrate processing device according to  claim 4 , wherein
 the water removing unit adds the water removing agent to the volatile solvent in a solvent supply passage forcedly feeding the volatile solvent in a solvent supply tank.   
     
     
         13 . The substrate processing device according to  claim 1 , wherein
 the water removing unit adds a water removing agent to the surface of the substrate without passing through a solvent supply passage connected to a solvent supply tank.   
     
     
         14 . The substrate processing device according to  claim 2 , wherein
 the water removing unit adds a water removing agent to the surface of the substrate without passing through a solvent supply passage connected to a solvent supply tank.   
     
     
         15 . The substrate processing device according to  claim 3 , wherein
 the water removing unit adds a water removing agent to the surface of the substrate without passing through a solvent supply passage connected to a solvent supply tank.   
     
     
         16 . The substrate processing device according to  claim 4 , wherein
 the water removing unit adds a water removing agent to the surface of the substrate without passing through a solvent supply passage connected to a solvent supply tank.   
     
     
         17 . A substrate processing method comprising the steps of;
 supplying a cleaning water to a surface of a substrate; and   supplying a volatile solvent to the surface of the substrate supplied with the cleaning water, and replacing the cleaning water on the surface of the substrate with the volatile solvent, wherein   when the volatile solvent is supplied to the surface of the substrate, a water removing agent is supplied to the surface of the substrate by a water removing unit, and replacement of the cleaning water on the surface of the substrate with the volatile solvent is promoted.   
     
     
         18 . The substrate processing method according to  claim 17 , wherein
 the water removing agent is made of a hydrolyzable substance.   
     
     
         19 . The substrate processing method according to  claim 17 , wherein
 the surface of the substrate supplied with the volatile solvent is heated to dry the surface of the substrate by removing a droplet of the volatile solvent produced on the surface of the substrate by a heating operation.   
     
     
         20 . The substrate processing method according to  claim 18 , wherein
 the surface of the substrate supplied with the volatile solvent is heated to dry the surface of the substrate by removing a droplet of the volatile solvent produced on the surface of the substrate by a heating operation.