US2015116950A1PendingUtilityA1

Coil component, manufacturing method thereof, coil component-embedded substrate, and voltage adjustment module having the same

Assignee: SAMSUNG ELECTRO MECHPriority: Oct 29, 2013Filed: Oct 27, 2014Published: Apr 30, 2015
Est. expiryOct 29, 2033(~7.2 yrs left)· nominal 20-yr term from priority
H01F 2027/2809H01F 27/29H05K 7/02H01F 41/02H01F 27/2804H05K 1/185H05K 1/116H01F 27/255H05K 2201/1003Y10T29/49075H05K 2201/10196H05K 2201/086H05K 3/46H01F 27/022
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Claims

Abstract

A coil component may be capable of being easily manufactured and significantly decreasing direct current (DC) resistance of its wiring. The coil component may include a coil assembly including a core substrate and coil patterns formed on the core substrate; and a magnetic material part embedding the coil assembly therein.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A coil component comprising:
 at least one core substrate;   at least one internal conductor on at least one surface of the core substrate; and   a magnetic material part outside of the core substrate,   wherein the internal conductor has a width at least the same as that of the core substrate.   
     
     
         2 . The coil component of  claim 1 , wherein the core substrate and the internal conductor are in a ring shape. 
     
     
         3 . The coil component of  claim 1 , wherein the magnetic material part embeds the core substrate and the internal conductor therein. 
     
     
         4 . The coil component of  claim 1 , wherein the internal conductor includes a plurality of internal conductors respectively on two surfaces of the core substrate, and
 the internal conductors are electrically connected to each other by at least one connection conductor.   
     
     
         5 . The coil component of  claim 4 , wherein the connection conductor is in a shape of a conductive via penetrating the core substrate. 
     
     
         6 . The coil component of  claim 1 , further comprising: an insulating layer between the internal conductor and the magnetic material part. 
     
     
         7 . The coil component of  claim 1 , further comprising: an insulating film between the internal conductor and the magnetic material part. 
     
     
         8 . The coil component of  claim 1 , further comprising: an insulating layer between one surface of the internal conductor and the magnetic material part and an insulating oxide film between a side surface of the internal conductor and the magnetic material part. 
     
     
         9 . The coil component of  claim 1 , wherein the magnetic material part is made of an insulating material containing a magnetic powder or a metal powder. 
     
     
         10 . The coil component of  claim 1 , further comprising:
 an insulating material part on an external surface of the magnetic material part;   at least one external electrode on an external surface of the insulating material part; and   at least one through via electrically connecting the internal conductor and the external electrode to each other.   
     
     
         11 . The coil component of  claim 10 , wherein the external electrode is on upper and lower surfaces of the insulating material part. 
     
     
         12 . A coil component comprising:
 at least one core substrate;   at least one internal conductor on at least one surface of the core substrate; and   a magnetic material part outside of the core substrate,   wherein an external peripheral edge and an inner peripheral edge of the internal conductor are at the same positions as those of the core substrate.   
     
     
         13 . A manufacturing method of a coil component, comprising:
 preparing a core substrate having a metal layer formed on at least one surface thereof;   processing the core substrate in a ring shape by cutting the core substrate by a pressing method; and   forming a magnetic material part outside of the core substrate having the ring shape.   
     
     
         14 . The manufacturing method of  claim 13 , further comprising: after the preparing of the core substrate, forming multilayer patterns by processing the core substrate. 
     
     
         15 . The manufacturing method of  claim 14 , wherein the forming of the multilayer patterns includes:
 electrically connecting metal layers respectively formed on both surfaces of the core substrate to each other by forming a connection conductor in the core substrate; and   forming separation grooves by removing portions of the metal layers.   
     
     
         16 . The manufacturing method of  claim 15 , wherein in the forming of the separation grooves, the respective separation grooves are formed in two metal layers while being provided in both sides of the connection conductor. 
     
     
         17 . The manufacturing method of  claim 15 , further comprising: after the forming of the separation grooves, forming insulating layers on external surfaces of the metal layers. 
     
     
         18 . The manufacturing method of  claim 13 , further comprising: after the processing of the core substrate, forming an insulating film on an external surface of an internal conductor formed by cutting the metal layer. 
     
     
         19 . The manufacturing method of  claim 18 , wherein in the forming of the insulating film, an oxide film is formed on an exposed surface of the internal conductor. 
     
     
         20 . The manufacturing method of  claim 18 , further comprising: after the forming of the magnetic material part outside of the core substrate, forming an insulator layer on an external surface of the magnetic material part. 
     
     
         21 . The manufacturing method of  claim 20 , further comprising: after the forming of the insulator layer, forming at least one through via in the insulator layer, the through via being electrically connected to the internal conductor; and
 forming at least one external electrode on an external surface of the insulator layer, the external electrode being electrically connected to the through via.   
     
     
         22 . A coil component-embedded substrate comprising:
 at least one insulating layer; and   a coil component including a core substrate having an internal conductor on at least one surface thereof and a magnetic material part formed outside of the core substrate and embedded in the insulating layer, the internal conductor having a width at least the same as that of the core substrate.   
     
     
         23 . A voltage adjustment module comprising:
 a substrate;   a power inductor including a core substrate having an internal conductor on at least one surface thereof and a magnetic material part outside of the core substrate and embedded in the substrate, the internal conductor having a width at least the same as that of the core substrate; and   at least one voltage adjusting element mounted on the substrate and electrically connected to the power inductor.   
     
     
         24 . The voltage adjustment module of  claim 23 , wherein the voltage adjusting element adjusts an amount of voltage provided to a radio frequency (RF) power amplifier depending on a magnitude of a radio signal in an envelope tracking (ET) power amplifier. 
     
     
         25 . The voltage adjustment module of  claim 24 , wherein portions of the magnetic material part disposed above and below the core substrate respectively have a thickness of 50 μm or more. 
     
     
         26 . A coil component comprising:
 at least one cylindrical core substrate;   internal sheet-like conductors on opposing end surfaces of the core substrate; and   a magnetic material part outside of the core substrate,   wherein the internal conductors have an outer diameter at least as large as that of the core substrate.   
     
     
         27 . The coil component of  claim 26 , wherein the core substrate and the internal conductors are in a ring shape. 
     
     
         28 . The coil component of  claim 26 , wherein the internal conductors are electrically connected to each other by at least one connection conductor. 
     
     
         29 . The coil component of  claim 28 , wherein the connection conductor is in a shape of a conductive via penetrating through the core substrate.

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