Inventor · disambiguated record
Suk Hyeon Cho
Also filed as: CHO SUK H · CHO SUK HYEON
17 granted patents·32 pending applications·245 citations·filing 2004–2016
93Inventor score
Top patents by PatentIndex Score
49 records- 0198US7282394B2Printed circuit board including embedded chips and method of fabricating the same using platingSAMSUNG ELECTRO MECH·Filed 2005·Granted Oct 16, 2007·114 cites·6 claims
- 0293US7564116B2Printed circuit board with embedded capacitors therein and manufacturing process thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 21, 2009·33 cites·10 claims
- 0386US7485569B2Printed circuit board including embedded chips and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Feb 3, 2009·13 cites·10 claims
- 0484US9736927B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 15, 2017·4 cites·9 claims
- 0583US7351915B2Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2004·Granted Apr 1, 2008·31 cites·8 claims
- 0682US9490056B2Coil component and electronic module using the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Nov 8, 2016·4 cites·15 claims
- 0782US7499258B2Embedded multilayer chip capacitor and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Mar 3, 2009·13 cites·17 claims
- 0880US9736939B2Printed circuit board and method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 15, 2017·3 cites·19 claims
- 0978US7378326B2Printed circuit board with embedded capacitors therein and manufacturing process thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted May 27, 2008·9 cites·18 claims
- 1077US10045436B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Aug 7, 2018·5 cites·3 claims
- 1172US8563141B2Carrier for manufacturing printed circuit board, method of manufacturing the same and method of manufacturing printed circuit board using the sameLEE JAE JOON·Filed 2010·Granted Oct 22, 2013·1 cites·3 claims
- 1270US7506437B2Printed circuit board having chip package mounted thereon and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Mar 24, 2009·3 cites·5 claims
- 1368US7903410B2Package board and method for manufacturing thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Mar 8, 2011·4 cites·7 claims
- 1465US8883016B2Carrier for manufacturing printed circuit board, method of manufacturing the same and method of manufacturing printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 11, 2014·0 cites·10 claims
- 1561US8064217B2Component embedded printed circuit boardCHO SUK-HYEON·Filed 2007·Granted Nov 22, 2011·2 cites·5 claims
- 1656US2009152233A1Printed circuit board having chip package mounted thereon and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1755US2011005824A1Printed circuit board and method of manufacturing the sameAN JIN YONG·Filed 2009·Application pending·0 cites
- 1853US2012210576A1Printed circuit board and method of manufacturing the sameAN JIN YONG·Filed 2012·Application pending·0 cites
- 1951US7169707B2Method of manufacturing package substrate with fine circuit pattern using anodic oxidationSAMSUNG ELECTRO MECH·Filed 2004·Granted Jan 30, 2007·6 cites·33 claims
- 2051US2008314621A1Parallel chip embedded printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2151US2011079349A1Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2251US2015101851A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2350US8683684B2Method of manufacturing component embedded printed circuit boardCHO SUK-HYEON·Filed 2011·Granted Apr 1, 2014·0 cites·7 claims
- 2450US2009147488A1Printed circuit board having chip package mounted thereon and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2550US2007146980A1Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2649US2014166348A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2749US2015116950A1Coil component, manufacturing method thereof, coil component-embedded substrate, and voltage adjustment module having the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2849US2015173197A1Printed circuit board having inductor embedded therein and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2949US2014151095A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3048US2014027163A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3146US2007007636A1Parallel chip embedded printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 3246US2007111380A1Fabricating method of printed circuit board having embedded componentSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 3345US2015319852A1Printed circuit board, printed circuit board strip and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3445US2015373842A1Substrate strip, substrate panel, and manufacturing method of substrate stripSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3545US2015114553A1Method of manufacturing glass coreSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3643US2015107880A1Multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3742US2013126215A1Printed circuit board and method for manufacturing the sameCHO SUK HYEON·Filed 2012·Application pending·0 cites
- 3841US2011048786A1Printed circuit board having a bump and a method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 3941US2006191711A1Embedded chip printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 4041US2008000680A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 4140US2011308845A1Printed circuit board and method of manufacturing the sameCHO SUK HYEON·Filed 2011·Application pending·0 cites
- 4240US2006291173A1Printed circuit board with embedded electronic componentsSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 4337US2016234929A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 4436US2015373841A1Core and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 4536US2006014327A1Method of fabricating PCB including embedded passive chipSAMSUNG ELECTRO MECH·Filed 2004·Application pending·0 cites
- 4634US2016128186A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 4734US2012111728A1Method of manufacturing circuit boardCHO SUK HYEON·Filed 2011·Application pending·0 cites
- 4831US2015223341A1Embedded board, printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 4930US2016374198A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →