Vapor Deposition of Metal Oxides, Silicates and Phosphates, and Silicon Dioxide
Abstract
Metal silicates or phosphates are deposited on a heated substrate by the reaction of vapors of alkoxysilanols or alkylphosphates along with reactive metal amides, alkyls or alkoxides. For example, vapors of tris(tert-butoxy)silanol react with vapors of tetrakis(ethylmethylamido)hafnium to deposit hafnium silicate on surfaces heated to 300° C. The product film has a very uniform stoichiometry throughout the reactor. Similarly, vapors of diisopropylphosphate react with vapors of lithium bis(ethyldimethylsilyl)amide to deposit lithium phosphate films on substrates heated to 250° C. Supplying the vapors in alternating pulses produces these same compositions with a very uniform distribution of thickness and excellent step coverage.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A process for forming materials comprising silicon, oxygen and one or more metals or metalloids, comprising:
reacting the vapor of one of an alkoxysilanol and an alkoxysilanediol together with a vapor of one or more of a metal compound and a metalloid compound.
2 . A process for forming materials comprising silicon, oxygen and one or more metals or metalloids, comprising:
exposing a substrate alternately to the vapor of one or an alkoxysilanol and an alkoxysilanediol and the vapor of one or more of a metal compound or a metalloid compound to form a film on the substrate.
3 . The process of claim 1 , wherein compound is deposited as a film on a substrate.
4 . The process as in claim 1 or 2 , wherein the silanol has the formula
where the R n represents hydrogen, alkyl groups, fluoroalkyl groups or alkyl groups substituted by other atoms or groups, R n being any one of the groups R 1 through R 9 , and where R n are the same or different.
5 . The process of claim 4 , wherein the groups R n contain between one and four carbons and are the same or different.
6 . The process of claim 5 , wherein the groups R n are all methyl groups.
7 . The process of claim 5 , wherein R 1 , R 4 and R 7 are ethyl groups and R 2 , R 3 , R 5 , R 6 , R 8 and R 9 are methyl groups and the silanol has the formula
8 . The process of claim 1 or 2 , wherein a metal or metalloid compound contains metal-nitrogen or metalloid-nitrogen bonds.
9 . The process of claim 8 , wherein a metal or metalloid compound is selected from Table 1.
10 . The process of claim 1 or 2 , wherein a metal compound is selected from Table 2.
11 . The process of claim 1 or 2 , wherein a metal or metalloid compound is selected from Table 3.
12 . A process for forming materials comprising phosphorus, oxygen and one or more metals or metalloids, comprising:
reacting a vapor of a bis(alkyl)phosphate with a vapor of one or more of a metal compound and a metalloid compound.
13 . A process for forming materials comprising phosphorus, oxygen and one or more metals or metalloids, comprising:
exposing a substrate alternately to a vapor of a bis(alkyl)phosphate and a vapor of one or more of a metal compound and metalloid compound to form a film on the substrate.
14 . The process of claim 12 , wherein the material comprising phosphorus, oxygen and one or more metals or metalloids is deposited as a film on a substrate.
15 . The process as in claim 12 or 13 , wherein the bis(alkyl)phosphate has the formula
where the R n represents hydrogen, alkyl groups, fluoroalkyl groups or alkyl groups substituted by other atoms or groups, R n being any one of the groups R 1 through R6, and wherein R n are the same or different.
16 . The process of claim 15 , wherein the groups R n contain between one and four carbons and may be the same or different.
17 . The process of claim 16 , wherein the groups R 1 , R 3 , R 4 and R 6 are methyl groups, the groups R 2 and R 5 are hydrogen, and the compound has the formula
18 . The process of claim 12 or 13 , wherein a metal or metalloid compound contains metal-nitrogen or metalloid-nitrogen bonds.
19 . The process of claim 18 , wherein a metal or metalloid compound is chosen from Table 1.
20 . The process of claim 12 or 13 , wherein a metal compound is chosen from Table 2.
21 . The process of claim 13 or 14 , wherein a metal or metalloid compound is selected from Table 3.
22 . A process for forming a material comprising silicon, comprising:
exposing a substrate to one or more vapors chosen from the group consisting of alkoxysilanols, alkoxysilanediols and silylenes.
23 . The process of claim 22 , wherein the silylene is the compound described by the formula
wherein R is an alkyl group.
24 . The process of claim 23 , wherein R is tert-butyl.
25 . A process for forming a material comprising phosphorus, comprising:
exposing a substrate to one or more vapors selected from the group consisting of bis(alkyl)phosphates, phosphorus(III) oxide and white phosphorus.
26 . A process for forming a material comprising oxygen, comprising:
exposing a substrate to one or more vapors chosen from the group consisting of arene hydrates.
27 . The process of claim 26 , wherein the arene hydrate is benzene hydrate, a naphthalene hydrate, a substituted benzene hydrate or a substituted naphthalene hydrate.
28 . A process for forming a metal oxide, comprising:
exposing a heated surface alternately to the vapor of one or more metal amides and then to the vapors of water or an alcohol.
29 . A process as in claim 28 , wherein the alcohol is an arene hydrate.
30 . A process as in claim 28 , wherein the metal amide or amides are chosen from Table 1.
31 . A process for forming material comprising oxygen and one or more metals, comprising:
exposing a surface alternately to the vapor of one or more organometallic compounds and then to the vapors of an arene hydrate.
32 . A process as in claim 31 , wherein the organometallic compounds are chosen from Table 2.Join the waitlist — get patent alerts
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