Led package and manufacturing process of same

Abstract

A LED package is formed of a substrate, an LED chip, an insulated layer, and a fluorescent adhesive layer. The substrate includes a positive contact and a negative contact. The LED chip is fixed to the substrate and includes a positive terminal and a negative terminal, the former of which is electrically connected with the positive contact and latter is electrically connected with the negative contact. The insulated layer is mounted to the surface of the substrate and surrounds the LED chip. The fluorescent adhesive layer is mounted to a surface of the insulated layer and covers the LED chip. In this way, the LED package can reduce the production cost and the whole size.

What is claimed is: 
     
         1 . An LED package comprising:
 a substrate having a positive contact and a negative contact, the positive and negative contacts being located at the same side of the substrate;   an LED chip mounted to the substrate and having a positive terminal and a negative terminal, the positive terminal being electrically connected with the positive contact of the substrate, the negative terminal being electrically connected with the negative contact of the substrate;   an insulated layer mounted to the substrate and surrounding the LED chip; and   a fluorescent adhesive layer mounted to a surface of the insulated layer and covering the LED chip.   
     
     
         2 . The LED package as defined in  claim 1 , wherein the substrate comprises a fiber prepreg, a first metallic layer, and a second metallic layer, the fiber prepreg having a front side and a rear side, the first and second metallic layers being mounted to the front and rear sides of the fiber prepreg, respectively, the positive and negative contacts being mounted to a surface of the first metallic layer. 
     
     
         3 . The LED package as defined in  claim 1 , wherein the substrate comprises a transparent layer and a metallic layer, the transparent layer having a front side and a rear side, the metallic layer being mounted to the front side of the transparent layer; the positive and negative contacts being mounted to the metallic layer. 
     
     
         4 . The LED package as defined in  claim 3 , wherein the transparent layer comprises another florescent layer mounted to the rear side thereof. 
     
     
         5 . The LED package as defined in  claim 1 , wherein the insulated layer is white in color.