Assignee
LINGSEN PRECISION IND LTD
TW·19 granted patents·38 pending applications·247 citations·filing 2002–2015
Top patents by PatentIndex Score
57 records- 0196US8362496B1Optical module package unitLINGSEN PRECISION IND LTD·Filed 2011·Granted Jan 29, 2013·54 cites·8 claims
- 0294US6770498B2LED package and the process making the sameLINGSEN PRECISION IND LTD·Filed 2002·Granted Aug 3, 2004·147 cites·5 claims
- 0386US9260298B1Stacked MEMS microphone packaging methodLINGSEN PRECISION IND LTD·Filed 2014·Granted Feb 16, 2016·11 cites·17 claims
- 0485US9190398B2Method for packaging an optical moduleLINGSEN PRECISION IND LTD·Filed 2013·Granted Nov 17, 2015·7 cites·5 claims
- 0584US9449955B2Optical module integrated packageLINGSEN PRECISION IND LTD·Filed 2014·Granted Sep 20, 2016·6 cites·10 claims
- 0676US9705025B2Package structure of an optical moduleLINGSEN PRECISION IND LTD·Filed 2013·Granted Jul 11, 2017·4 cites·7 claims
- 0776US9063084B1Gas sensor having micro-package structure and method for making the sameLINGSEN PRECISION IND LTD·Filed 2014·Granted Jun 23, 2015·4 cites·11 claims
- 0875US9647178B2Package structure of optical module having printed shielding layer and its method for packagingLINGSEN PRECISION IND LTD·Filed 2013·Granted May 9, 2017·4 cites·5 claims
- 0971US9478693B2Optical module package and its packaging methodLINGSEN PRECISION IND LTD·Filed 2015·Granted Oct 25, 2016·2 cites·12 claims
- 1070US9416930B2LED lamp strip and manufacturing process thereofLINGSEN PRECISION IND LTD·Filed 2014·Granted Aug 16, 2016·2 cites·2 claims
- 1166US9312402B2Micro optical package structure with filtration layer and method for making the sameLINGSEN PRECISION IND LTD·Filed 2014·Granted Apr 12, 2016·2 cites·19 claims
- 1262US7242083B2Substrate for IC packageLINGSEN PRECISION IND LTD·Filed 2005·Granted Jul 10, 2007·2 cites·5 claims
- 1352US8980659B1LED package and manufacturing process of sameLINGSEN PRECISION IND LTD·Filed 2013·Granted Mar 17, 2015·0 cites·5 claims
- 1451US2015206852A1Copper clad laminate having barrier structure and method of manufacturing the sameLINGSEN PRECISION IND LTD·Filed 2014·Application pending·0 cites
- 1551US2015111324A1Package structure of optical moduleLINGSEN PRECISION IND LTD·Filed 2014·Application pending·0 cites
- 1651US2015091024A1Package structure of optical moduleLINGSEN PRECISION IND LTD·Filed 2014·Application pending·0 cites
- 1749US7884467B2Package structure of a microphoneLINGSEN PRECISION IND LTD·Filed 2008·Granted Feb 8, 2011·1 cites·14 claims
- 1849US2015028371A1Package structure of optical moduleLINGSEN PRECISION IND LTD·Filed 2013·Application pending·0 cites
- 1947US2009286355A1Flip-chip process by photo-curing adhesiveLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
- 2047US2009239341A1Ic packaging processLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
- 2147US2009186450A1Ic packaging process by photo-curing adhesiveLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
- 2247US2009178758A1Method of arranging stacked chip by photo-curing adhesiveLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
- 2346US2009239339A1Method of stacking dies for die stack packageLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
- 2446US2009236712A1Ic package having reduced thicknessLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
- 2546US2008122073A1MEMS module packageLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 2645US9553073B2Chip stack structure using conductive film bridge adhesive technologyLINGSEN PRECISION IND LTD·Filed 2014·Granted Jan 24, 2017·0 cites·4 claims
- 2745US2009181499A1Ic packaging processLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
- 2845US2015144982A1Led package and manufacturing process of sameLINGSEN PRECISION IND LTD·Filed 2015·Application pending·0 cites
- 2944US2008251869A1Photosensitive chip packageLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 3044US2008061409A1Micro electro-mechanical system module packageLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 3144US2015255423A1Copper clad laminate having barrier structure and method of manufacturing the sameLINGSEN PRECISION IND LTD·Filed 2015·Application pending·0 cites
- 3244US2008061392A1Photo-sensitive chip module packageLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 3344US2015069626A1Chip package, chip package module based on the chip package, and method of manufacturing the chip packageLINGSEN PRECISION IND LTD·Filed 2013·Application pending·0 cites
- 3444US2008061393A1Photosensitive chip molding packageLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 3544US2016093556A1Quad-flat non-lead package structure and method of packaging the sameLINGSEN PRECISION IND LTD·Filed 2014·Application pending·0 cites
- 3643US9309108B2MEMS microphone packaging methodLINGSEN PRECISION IND LTD·Filed 2014·Granted Apr 12, 2016·0 cites·13 claims
- 3743US2015279826A1Optical module with optical concentration structure and packaging method thereofLINGSEN PRECISION IND LTD·Filed 2014·Application pending·0 cites
- 3843US2015279796A1Quad-flat no-leads package structure and method of manufacturing the sameLINGSEN PRECISION IND LTD·Filed 2014·Application pending·0 cites
- 3941US8027153B2Lead frame for quad flat no-lead packageLINGSEN PRECISION IND LTD·Filed 2009·Granted Sep 27, 2011·1 cites·3 claims
- 4041US2015028357A1Package structure of an optical moduleLINGSEN PRECISION IND LTD·Filed 2013·Application pending·0 cites
- 4140US9618415B2Pressure sensor packageLINGSEN PRECISION IND LTD·Filed 2015·Granted Apr 11, 2017·0 cites·8 claims
- 4240US7154169B2Substrate for IC packageLINGSEN PRECISION IND LTD·Filed 2005·Granted Dec 26, 2006·0 cites·7 claims
- 4339US2008164583A1Chip package capable of minimizing electro-magnetic interferenceLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 4439US2009180655A1Package for mems microphoneLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
- 4538US2005104251A1Integrated circuit chip packaging processLINGSEN PRECISION IND LTD·Filed 2003·Application pending·0 cites
- 4638US2006223240A1Method of making substrate for integrated circuitLINGSEN PRECISION IND LTD·Filed 2005·Application pending·0 cites
- 4738US2006221586A1Packaging substrate having adhesive-overflowing prevention structureLINGSEN PRECISION IND LTD·Filed 2005·Application pending·0 cites
- 4838US2010096711A1Microelectromechanical system microphone packageLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
- 4938US2006249819A1Lead frame having contacting pins of different thicknessLINGSEN PRECISION IND LTD·Filed 2005·Application pending·0 cites
- 5037US2008079141A1Micro electro-mechanical system module package capable of minimizing interference of noisesLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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