Package structure of optical module

Abstract

A package structure of an optical module includes: a substrate defined with a light-emitting region and a light-admitting region; a light-emitting chip disposed at the light-emitting region of the substrate; a light-admitting chip disposed at the light-admitting region of the substrate; two encapsulants for enclosing the light-emitting chip and the light-admitting chip, respectively; and a shielding layer formed on the substrate and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively. Accordingly, the optical module package structure simplifies a packaging process and cuts manufacturing costs.

What is claimed is: 
     
         1 . A package structure of an optical module, comprising:
 a substrate defined with a light-emitting region and a light-admitting region;   a light-emitting chip disposed at the light-emitting region of the substrate;   a light-admitting chip disposed at the light-admitting region of the substrate;   two encapsulants for enclosing the light-emitting chip and the light-admitting chip, respectively; and   a shielding layer formed on the substrate and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively.   
     
     
         2 . The package structure of  claim 1 , wherein the encapsulants and the shielding layer are made of a transparent opaque resin. 
     
     
         3 . The package structure of  claim 1 , wherein the substrate is a non-ceramic substrate made of an organic material, such as Bismaleimide Triazine.