Inventor · disambiguated record
Ming-Te Tu
Also filed as: TU MING-TE
28 granted patents·19 pending applications·122 citations·filing 2002–2020
94Inventor score
Files withLINGSEN PRECISION IND LTD23LINGSEN PREC INDUSTRIES LTD17TU MING-TE6LINGSEN PREC INDUCTRIES LTD1
Top patents by PatentIndex Score
47 records- 0196US8362496B1Optical module package unitLINGSEN PRECISION IND LTD·Filed 2011·Granted Jan 29, 2013·54 cites·8 claims
- 0286US9260298B1Stacked MEMS microphone packaging methodLINGSEN PRECISION IND LTD·Filed 2014·Granted Feb 16, 2016·11 cites·17 claims
- 0385US9190398B2Method for packaging an optical moduleLINGSEN PRECISION IND LTD·Filed 2013·Granted Nov 17, 2015·7 cites·5 claims
- 0484US9449955B2Optical module integrated packageLINGSEN PRECISION IND LTD·Filed 2014·Granted Sep 20, 2016·6 cites·10 claims
- 0576US9705025B2Package structure of an optical moduleLINGSEN PRECISION IND LTD·Filed 2013·Granted Jul 11, 2017·4 cites·7 claims
- 0675US9647178B2Package structure of optical module having printed shielding layer and its method for packagingLINGSEN PRECISION IND LTD·Filed 2013·Granted May 9, 2017·4 cites·5 claims
- 0771US9478693B2Optical module package and its packaging methodLINGSEN PRECISION IND LTD·Filed 2015·Granted Oct 25, 2016·2 cites·12 claims
- 0870US9416930B2LED lamp strip and manufacturing process thereofLINGSEN PRECISION IND LTD·Filed 2014·Granted Aug 16, 2016·2 cites·2 claims
- 0969US10696543B1Waterproof MEMS chip package structureLINGSEN PREC INDUSTRIES LTD·Filed 2019·Granted Jun 30, 2020·1 cites·5 claims
- 1068US6948638B2Liquid rationing deviceTU MING TE·Filed 2003·Granted Sep 27, 2005·15 cites·8 claims
- 1166US9312402B2Micro optical package structure with filtration layer and method for making the sameLINGSEN PRECISION IND LTD·Filed 2014·Granted Apr 12, 2016·2 cites·19 claims
- 1259US7127907B2Headgear capable of sprinkling and coolingTU MING-TE·Filed 2004·Granted Oct 31, 2006·11 cites·6 claims
- 1358US11041774B2Pressure sensor packageLINGSEN PREC INDUSTRIES LTD·Filed 2018·Granted Jun 22, 2021·1 cites·7 claims
- 1458US8664045B2LED lamp strip and manufacturing process thereofTU MING-TE·Filed 2011·Granted Mar 4, 2014·1 cites·4 claims
- 1556US11410856B2Chip packaging methodLINGSEN PREC INDUSTRIES LTD·Filed 2020·Granted Aug 9, 2022·0 cites·3 claims
- 1651US10396234B2Package structure of long-distance sensor and packaging method of the sameLINGSEN PREC INDUSTRIES LTD·Filed 2017·Granted Aug 27, 2019·0 cites·7 claims
- 1751US9905548B2Optical module integrated packageLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted Feb 27, 2018·0 cites·8 claims
- 1851US2015111324A1Package structure of optical moduleLINGSEN PRECISION IND LTD·Filed 2014·Application pending·0 cites
- 1951US2015091024A1Package structure of optical moduleLINGSEN PRECISION IND LTD·Filed 2014·Application pending·0 cites
- 2051US2008023570A1Conductor-driving multi-hole micro sprinkle-nozzle and sprinkling cap made therewithTU MING-TE·Filed 2006·Application pending·0 cites
- 2149US2015028371A1Package structure of optical moduleLINGSEN PRECISION IND LTD·Filed 2013·Application pending·0 cites
- 2248US10103286B2Packaging method of long-distance sensorLINGSEN PREC INDUSTRIES LTD·Filed 2017·Granted Oct 16, 2018·0 cites·6 claims
- 2348US7511373B2Cap package for micro electro-mechanical systemLINGSEN PREC INDUCTRIES LTD·Filed 2007·Granted Mar 31, 2009·1 cites·4 claims
- 2444US9952089B2Optical sensing module and method of manufacturing the sameLINGSEN PREC INDUSTRIES LTD·Filed 2014·Granted Apr 24, 2018·0 cites·6 claims
- 2544US2016093556A1Quad-flat non-lead package structure and method of packaging the sameLINGSEN PRECISION IND LTD·Filed 2014·Application pending·0 cites
- 2643US9309108B2MEMS microphone packaging methodLINGSEN PRECISION IND LTD·Filed 2014·Granted Apr 12, 2016·0 cites·13 claims
- 2743US2015279826A1Optical module with optical concentration structure and packaging method thereofLINGSEN PRECISION IND LTD·Filed 2014·Application pending·0 cites
- 2843US2020105636A1Chip package structure having function of preventing adhesive from overflowingLINGSEN PREC INDUSTRIES LTD·Filed 2018·Application pending·0 cites
- 2943US2015279796A1Quad-flat no-leads package structure and method of manufacturing the sameLINGSEN PRECISION IND LTD·Filed 2014·Application pending·0 cites
- 3041US10312169B1Substrate and package module including the sameLINGSEN PREC INDUSTRIES LTD·Filed 2018·Granted Jun 4, 2019·0 cites·6 claims
- 3141US2015028357A1Package structure of an optical moduleLINGSEN PRECISION IND LTD·Filed 2013·Application pending·0 cites
- 3240US9618415B2Pressure sensor packageLINGSEN PRECISION IND LTD·Filed 2015·Granted Apr 11, 2017·0 cites·8 claims
- 3340US2020109044A1Microelectromechanical microphone package structureLINGSEN PREC INDUSTRIES LTD·Filed 2018·Application pending·0 cites
- 3439US10090427B2Package structure of long-distance sensor and packaging method of the sameLINGSEN PREC INDUSTRIES LTD·Filed 2017·Granted Oct 2, 2018·0 cites·10 claims
- 3539US10003874B2Microphone package structureLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted Jun 19, 2018·0 cites·20 claims
- 3639US2006292021A1Automatic liquid dispensing mechanismTU MING-TE·Filed 2002·Application pending·0 cites
- 3739US2008164583A1Chip package capable of minimizing electro-magnetic interferenceLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 3838US2006011656A1Liquid extruding deviceTU MING-TE·Filed 2004·Application pending·0 cites
- 3937US2008079141A1Micro electro-mechanical system module package capable of minimizing interference of noisesLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 4037US2008164602A1Cap package for micro electro-mechanical system capable of minimizing electro-magnetic interferenceLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 4135US10362377B2MEMS microphone packageLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted Jul 23, 2019·0 cites·18 claims
- 4235US2018190630A1Package structure of optical moduleLINGSEN PREC INDUSTRIES LTD·Filed 2017·Application pending·0 cites
- 4334US10362406B2MEMS microphone packageLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted Jul 23, 2019·0 cites·12 claims
- 4434US10299046B2MEMS microphone packageLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted May 21, 2019·0 cites·5 claims
- 4534US2018063616A1Microelectromechanical microphone package structureLINGSEN PREC INDUSTRIES LTD·Filed 2016·Application pending·0 cites
- 4634US2015028358A1Package structure of an optical moduleLINGSEN PRECISION IND LTD·Filed 2013·Application pending·0 cites
- 4732US2016157024A1Flip-chip mems microphoneLINGSEN PRECISION IND LTD·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ming-Te Tu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →