Method and apparatus for supporting a computer chip on a printed circuit board assembly

Abstract

A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.

What is claimed is: 
     
         1 . A printed circuit board assembly comprising:
 a circuit board substrate;   a plurality of electrical components including at least one chip having a foot print and an adjacent component; the board substrate having a plurality of mounting points for receiving electrical components;   an underfill material interposed between the at least one chip and the board substrate for working to secure the chip to the board substrate;   a barrier defined by the circuit board substrate to limit the flow of the underfill such that the underfill does not interact with at least one adjacent component;   an underfill deposit area interposed between the foot print of the chip and the barrier; and   wherein during assembly of the printed circuit board underfill is dispensed at the underfill deposit area and is drawn between the at least one chip and the circuit board substrate and wherein the flow of the underfill is limited by the barrier to a predetermined area defined by the barrier.