Manufacturing method of probing device

Abstract

A manufacturing method of a probing device is provided. The manufacturing method includes following steps. First, a plurality of space transformers is disposed on a reinforcing plate and the space transformer includes a plurality of first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings are formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.

What is claimed is: 
     
         1 . A manufacturing method for a probing device comprising:
 providing a reinforcing plate;   disposing a plurality of space transformers on the reinforcing plate, wherein a plurality of first pads are disposed on a surface of each space transformer;   fixing the space transformer on the reinforcing plate, for configuring the internal circuitry of the space transformer to be electrically connected to the internal circuitry of the reinforcing plate;   forming a photoresist film on the space transformer, wherein the photoresist film comprises a plurality of openings and at least a portion of the first pad is disposed in the opening;   forming a metal layer in each of the plurality of openings, wherein the metal layer is disposed on and is directly contacted with the plurality of first pads for forming a plurality of second pads;   providing a printed circuit board and electrically connecting the internal circuitry of the reinforcing plate to the internal circuitry of the printed circuit board; and   providing a probe head, the probe head comprising a plurality of probing areas, each probing area corresponding to one of the plurality of space transformers, each probing area comprising a plurality of probes, wherein the probe is electrically connected to the internal circuitry of the space transformer via the second pad.   
     
     
         2 . The manufacturing method for the probing device of  claim 1 , wherein the metal layer is formed in the opening via electroplating. 
     
     
         3 . The manufacturing method for the probing device of  claim 1 , wherein a plurality of positioning points are disposed on the reinforcing plate and the space transformer is positioned on the reinforcing plate by leaning against the positioning point. 
     
     
         4 . The manufacturing method for the probing device of  claim 1 , wherein fixing the space transformer on the reinforcing plate comprises:
 providing a cage, wherein the cage comprises a plurality of positioning cavities;   disposing the space transformer in the positioning cavity; and   arranging the reinforcing plate to be close to the cage and soldering the space transformer onto the reinforcing plate.   
     
     
         5 . The manufacturing method for the probing device of  claim 1 , further comprising forming an anti-oxidation layer on a surface of the second pad. 
     
     
         6 . The manufacturing method for the probing device of  claim 1 , further comprising planarizing the second pad. 
     
     
         7 . The manufacturing method for the probing device of  claim 1 , further comprising a step of removing the photoresist film after forming the metal layer in each of the plurality of openings. 
     
     
         8 . The manufacturing method for the probing device of  claim 1 , wherein the surface on which the first pads are disposed is facing away the reinforcing plate. 
     
     
         9 . The manufacturing method for the probing device of  claim 1 , wherein a center line of at least one second pad does not overlap a center line of the first pad being covered below the second pad. 
     
     
         10 . The manufacturing method for the probing device of  claim 9 , wherein a center of the second pad on each space transforming plate and a center of the second pad of a corresponding position on a neighboring space transforming plate are aligned to one horizontal extension line or one vertical extension line. 
     
     
         11 . The manufacturing method for the probing device of  claim 1 , wherein a reflow process is performed for fixing the space transformer on the reinforcing plate.